5SGXMA7N1F45C2WN

The 5SGXMA7N1F45C2WN is a Stratix V GX field programmable gate array (FPGA) in a 1932-ball FCBGA package designed for commercial-grade applications. It provides a high density of programmable logic, embedded memory, and I/O to support complex digital systems where integration, board-level density, and configurability are required.

Key architectural highlights include 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and up to 840 I/O pins, making this device suitable for designs that demand substantial logic capacity and large embedded memory within a compact surface-mount package.

Key Features

• Core Logic Capacity  622,000 logic elements for implementing large-scale digital designs and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• I/O Density  Up to 840 I/O pins to enable wide parallel interfaces and multi-channel connectivity.
• Package & Mounting  Surface-mount 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45) for compact board integration.
• Core Voltage  Core supply range of 870 mV to 930 mV to match system power rails for core operation.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
• Regulatory & Environmental  RoHS compliant.

Typical Applications

• High-density digital processing  Implement large custom logic blocks and datapaths using 622,000 logic elements and abundant embedded RAM.
• Memory-intensive algorithms  Use approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, or FPGA-based accelerators.
• Multi-channel I/O aggregation  Deploy wide parallel interfaces or aggregate multiple serial/protocol channels using up to 840 I/Os.
• Compact board designs  Integrate high logic and I/O density into space-constrained systems with the 1932-ball FCBGA surface-mount package.

Unique Advantages

• High logic scalability: 622,000 logic elements provide headroom for large state machines, datapaths, and custom processors without external logic.
• Significant on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces the need for external memory for many buffering and algorithmic tasks.
• Extensive I/O count: Up to 840 I/Os enable complex board-level connectivity and interface consolidation.
• Compact, surface-mount packaging: The 1932-BBGA (FCBGA) package supports high-density PCB layouts while keeping the FPGA footprint efficient.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV aligns with modern low-voltage power designs.

Why Choose 5SGXMA7N1F45C2WN?

The 5SGXMA7N1F45C2WN combines very high logic density, substantial embedded RAM, and a large I/O count in a single commercial-grade, surface-mount FCBGA package. It is positioned for engineers and designers who need to consolidate complex digital functions onto a single FPGA while preserving board real estate and minimizing external memory and logic.

This device is a practical choice for commercial systems that require scalable programmable logic, abundant on-chip memory, and flexible I/O — delivered with RoHS compliance and defined operating and core-voltage ranges for predictable integration into your designs.

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