5SGXMA7N1F45I2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 1,247 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N1F45I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA7N1F45I2G is an industrial-grade Stratix V GX field programmable gate array (FPGA) from Intel, delivered in a high-density 1932-BBGA FCBGA package. Designed for applications that require significant programmable logic, large embedded memory, and extensive I/O resources, this device supports demanding system designs in communications, high-performance embedded processing, and test/measurement equipment.

Key architectural highlights include approximately 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/O pins. The device operates across an industrial temperature range and uses a low-voltage supply domain appropriate to Stratix V core requirements.

Key Features

  • Logic Capacity  Approximately 622,000 logic elements for implementing large, complex digital designs and custom accelerators.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
  • I/O Density  840 programmable I/O pins to support broad peripheral connectivity, multi-lane interfaces, and system-level integration.
  • High‑density Package  1932-BBGA (FCBGA) supplier package — 1932-FBGA, FC (45×45) — enabling compact board-level integration while providing high pin count.
  • Power Supply Range  Voltage supply specified at 870 mV to 930 mV, matching the device core operating window defined for Stratix V devices.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Surface Mount  Surface-mount device suitable for standard PCB assembly processes.
  • Stratix V GX Family Transceiver Options  Family-level documentation indicates GX channel options across multiple speed grades (for example, GX channel data rates up to 14.1 Gbps depending on speed grade).
  • RoHS Compliant  Build and materials conform to RoHS requirements.

Typical Applications

  • High‑Performance Networking and Communications  Implement packet processing, protocol offload, and interface bridging using the device’s large logic capacity and extensive I/O.
  • Data Processing and Acceleration  Custom hardware accelerators and streaming datapaths benefit from the combination of dense logic and substantial embedded RAM.
  • Test, Measurement, and Instrumentation  Complex signal processing, protocol emulation, and multi-channel I/O measurement systems leverage the device’s I/O count and industrial temperature rating.
  • Embedded System Integration  Consolidate multiple functions onto a single FPGA for system-level integration where on-chip memory and logic density reduce external component count.

Unique Advantages

  • Large, Scalable Logic Resource: The device’s approximately 622,000 logic elements enable large designs and scalable implementations without immediate partitioning across multiple devices.
  • Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduce dependence on external memory for buffering and state retention, simplifying board-level design.
  • High I/O Count: 840 I/O pins provide flexibility for multi‑lane interfaces, wide parallel buses, and dense peripheral connectivity.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial deployment temperature requirements.
  • Compact High‑Pin Package: 1932‑ball FCBGA (45×45 mm) enables high pin count in a manageable PCB footprint for complex systems.
  • Family-Level High‑Speed Transceiver Options: Stratix V GX family documentation details GX transceiver options across speed grades, offering designers choices for high-speed serial links where required.

Why Choose 5SGXMA7N1F45I2G?

The 5SGXMA7N1F45I2G positions itself as a high-density, industrial-grade Stratix V GX FPGA suitable for designs that require substantial programmable logic, on-chip RAM, and extensive I/O. Its combination of approximately 622,000 logic elements, about 51.2 Mbits of embedded memory, and 840 I/Os makes it a strong candidate for communications, data acceleration, and complex embedded systems where consolidation and integration matter.

Backed by Intel’s Stratix V family documentation and electrical specifications, this device offers designers a documented platform for building robust, high-capacity FPGA solutions that scale with design complexity and industrial operating requirements.

Request a quote or submit an inquiry to receive pricing, lead-time information, and technical support for the 5SGXMA7N1F45I2G.

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