5SGXMA7N1F45I2WN

The 5SGXMA7N1F45I2WN is an Intel Stratix V GX field programmable gate array (FPGA) offered in a 1932‑ball FCBGA package. As a high‑capacity Stratix V GX device, it targets designs that require substantial programmable logic, large on‑chip memory, and a high I/O count.

Designed for industrial temperature operation, this device provides a combination of logic density, embedded memory, and transceiver‑capable architecture suitable for high‑performance communications and signal processing applications.

Key Features

• Logic Capacity  Contains 622,000 logic element cells to implement complex digital designs and large programmable fabrics.
• Embedded Memory  Approximately 51.2 Mbits of embedded memory (total RAM bits: 51,200,000) for data buffering, FIFOs, and on‑chip storage.
• High I/O Count  840 user I/O pins provide extensive external connectivity for multi‑lane interfaces and dense board-level integration.
• Transceiver‑grade Architecture  Part of the Stratix V GX family with series transceiver speed grades (series documentation lists GX channel capabilities up to 14.1 Gbps), enabling high‑speed serial links at the family level.
• Power and Supply  Core voltage supply range specified at 870 mV to 930 mV to support the device’s core logic operating conditions.
• Packaging and Mounting  1932‑BBGA FCBGA package (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor suitable for modern board assembly.
• Industrial Temperature Grade  Specified operating temperature range from −40°C to 100°C for industrial deployment.
• Compliance  RoHS‑compliant manufacturing.

Typical Applications

• High‑speed communications  The Stratix V GX family’s transceiver capability (series‑level support up to 14.1 Gbps) and high I/O count make this device well suited for networking and telecom line cards and channel interfaces.
• Signal processing and compute acceleration  Large logic capacity and substantial on‑chip memory enable implementation of DSP, packet processing, and acceleration functions.
• Infrastructure and industrial systems  Industrial temperature rating and robust packaging support deployment in infrastructure equipment and industrial platforms requiring sustained operation across −40°C to 100°C.

Unique Advantages

• Large programmable fabric: 622,000 logic element cells support highly parallel architectures and complex integrations on a single device, reducing external component count.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM enables deep buffering and on‑chip data storage for bandwidth‑intensive designs.
• Extensive external connectivity: 840 I/O pins provide the interface density needed for multi‑lane, multi‑protocol systems and high‑pin‑count board designs.
• Industrial operating range: Rated from −40°C to 100°C for reliable performance in industrial environments.
• FCBGA surface‑mount package: 1932‑ball FCBGA (45×45) provides a compact, high‑pin‑count solution for modern PCB layouts.
• RoHS‑compliant: Manufactured to RoHS requirements for environmental compliance.

Why Choose 5SGXMA7N1F45I2WN?

The 5SGXMA7N1F45I2WN brings together substantial logic density, large embedded memory, and a high I/O complement in a single Stratix V GX FCBGA package, delivering the building blocks needed for demanding communications, signal processing, and infrastructure designs. Its industrial temperature rating and defined core supply range support robust deployment in environments that require consistent operation across a wide thermal range.

As part of the Intel Stratix V family, this device aligns with series‑level transceiver capabilities and the documentation and resources provided for Stratix V devices, making it suitable for engineering teams that require a high‑performance, scalable FPGA platform backed by established device documentation.

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