5SGXMA7N2F40C1WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 11 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N2F40C1WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA7N2F40C1WN is a Stratix V GX family FPGA from Intel, delivered in a 1517-BBGA FCBGA surface-mount package. It is a high-density programmable logic device offering large on-chip memory and extensive I/O connectivity for complex digital designs.
With approximately 622,000 logic elements, roughly 51.2 Mbits of embedded memory, and 600 I/O pins, this device addresses designs that require deep logic capacity, substantial embedded RAM, and broad external interfacing while operating from a core supply between 870 mV and 930 mV under commercial temperature conditions.
Key Features
- Core Logic Capacity Approximately 622,000 logic elements to implement large-scale digital functions and complex state machines.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and working memory for DSP and control logic.
- I/O Density 600 user I/O pins to support wide parallel interfaces, multi-lane connectivity, and extensive board-level integration.
- Package & Mounting 1517-BBGA (FCBGA) surface-mount package; supplier package listed as 1517-FBGA (40×40) for board-level planning.
- Power Core voltage supply range of 870 mV to 930 mV to match modern low-voltage FPGA power rails.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Standards Compliance RoHS compliant, supporting environmental and manufacturing requirements for restricted substances.
- Series-Level Transceiver Options As a Stratix V GX device (series-level information), the family includes configurable transceiver speed grades suitable for designs requiring high-speed serial connectivity (refer to the Stratix V device documentation for grade-specific transceiver details).
Typical Applications
- High-density signal processing Large logic capacity and abundant embedded memory make the device suitable for complex DSP algorithms and data-path processing.
- Multi-channel I/O systems With 600 I/Os, the FPGA can consolidate multiple parallel interfaces, sensors, or data lanes on a single device.
- Communication and networking endpoints Stratix V GX series transceiver options (series-level) combined with high logic density enable implementation of protocol processing and interface bridging.
- System integration and prototyping High resource counts support integration of control, compute, and interfacing logic for platform development and proof-of-concept systems.
Unique Advantages
- High logic integration: The large logic element count enables consolidation of multiple functions into a single FPGA, reducing component count and board complexity.
- Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports buffering and large working datasets without immediate external memory dependence.
- Extensive board-level I/O: 600 I/Os provide flexibility for parallel data paths and diverse peripheral connections, simplifying system partitioning.
- Commercial-temperature packaging: Rated for 0 °C to 85 °C with an industry-standard 1517-BBGA FCBGA package suitable for surface-mount assembly.
- Low-voltage core operation: The 870 mV–930 mV core supply range aligns with modern low-voltage power architectures for optimized power delivery design.
- RoHS compliance: Conforms to restricted substances requirements for regulated production environments.
Why Choose 5SGXMA7N2F40C1WN?
The 5SGXMA7N2F40C1WN positions itself as a high-density Stratix V GX FPGA option for engineers who need large logic capacity, significant embedded memory, and broad I/O capability in a single, surface-mount FCBGA package. Its commercial-grade temperature range and low-voltage core operation make it suitable for a wide range of performance-oriented systems where on-chip resources and I/O density drive integration choices.
This device is appropriate for teams building complex digital designs that benefit from the Stratix V family architecture and documentation. The combination of logic, memory, and connectivity supports scalable designs and system consolidation while relying on Intel’s Stratix V technical documentation for implementation details.
If you would like a quote or further purchasing information for the 5SGXMA7N2F40C1WN, submit a request or inquiry through your preferred procurement channel to receive pricing and availability details.

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