5SGXMA7N2F40C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,003 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N2F40C2LG – Stratix® V GX FPGA, 622,000 logic elements, 600 I/O
The 5SGXMA7N2F40C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It delivers high-density programmable logic with a large on-chip memory complement and a substantial I/O count, packaged in a 1517-ball FCBGA footprint.
Designed for commercial-temperature operation, this device addresses designs that require extensive logic capacity, embedded memory, and broad I/O integration while operating on a low core voltage range.
Key Features
- Logic Capacity Provides 622,000 logic elements, enabling complex, large-scale digital designs and high logic-density implementations.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support memory-intensive functions and buffering within the FPGA fabric.
- I/O Density 600 general-purpose I/Os to connect to a wide variety of peripherals, buses, and external interfaces.
- Power and Core Voltage Core voltage supply range from 820 mV to 880 mV, supporting low-voltage FPGA core operation.
- Package and Mounting 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact system integration.
- Operating Temperature and Grade Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial-environment deployments.
- RoHS Compliant Device is RoHS compliant, supporting regulatory requirements for restricted substances.
Typical Applications
- Complex digital systems Use the large logic capacity and embedded memory for implementing multi-function digital processing and control architectures.
- I/O‑heavy interface aggregation With 600 I/Os, the device is suitable for designs that require broad peripheral connectivity and multiple external interfaces.
- Memory-centric acceleration Approximately 51.2 Mbits of on-chip RAM enables buffering, packet processing, and other memory-dependent acceleration tasks within the FPGA fabric.
- Compact, high-density board designs The 1517-ball FCBGA surface-mount package supports space-constrained system boards while delivering significant logic and I/O resources.
Unique Advantages
- High logic density: 622,000 logic elements allow consolidation of large functions into a single device, reducing part count and board complexity.
- Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes external memory requirements for many applications.
- Extensive I/O capability: 600 I/Os support complex interfacing scenarios and multiple peripheral connections without external multiplexing.
- Low-voltage core operation: 820–880 mV core supply supports modern low-voltage FPGA power domains.
- Commercial-temperature rating: Rated for 0 °C to 85 °C operation, aligning with standard commercial deployment environments.
- RoHS compliant: Meets restricted-substance requirements for easier regulatory alignment in product designs.
Why Choose 5SGXMA7N2F40C2LG?
The 5SGXMA7N2F40C2LG positions itself as a high-density, commercially rated Stratix V GX FPGA suitable for designs demanding a large logic resource pool, significant embedded memory, and high I/O integration in a compact FCBGA package. Its low core-voltage range and RoHS compliance make it appropriate for modern commercial electronics platforms that prioritize integration and regulatory alignment.
This device is well suited for engineering teams and procurement groups building advanced digital systems that require consolidation of functions into a single FPGA to reduce BOM complexity and support scalable, memory-intensive designs.
Request a quote or submit a procurement inquiry for the 5SGXMA7N2F40C2LG to evaluate fit for your next design or production program.

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