5SGXMA7N2F40C3

The 5SGXMA7N2F40C3 is a Stratix V GX Field Programmable Gate Array (FPGA) supplied in a 1517-BBGA FCBGA package. It integrates large programmable logic capacity, substantial on‑chip memory, and a high count of I/O to support complex digital system designs.

Designed for commercial-temperature applications, this device offers a combination of dense logic (622,000 logic elements), approximately 51.2 Mbits of embedded memory, and up to 600 I/Os—making it suitable for designs that demand high integration and extensive I/O connectivity.

Key Features

• Core Logic  622,000 logic elements provide extensive programmable logic resources for complex combinational and sequential designs.
• Logic Blocks  234,720 logic blocks (as reported) for structured allocation of logic and routing resources.
• On‑Chip Memory  Approximately 51.2 Mbits of embedded RAM to support large buffering, lookup tables, and data-path storage without external memory.
• I/O Density  600 I/O pins to accommodate wide parallel buses, multiple interfaces, and high pin-count system connections.
• Power Supply  Core voltage range 820 mV to 880 mV to match system power-rail planning and power-management strategies.
• Package  1517-BBGA (supplier package: 1517-FBGA, 40×40) surface-mount package for compact board integration.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance  RoHS compliant to meet common environmental and regulatory requirements.
• Series Transceiver Capabilities (Series-Level)  Stratix V GX devices include transceiver speed grade options documented up to 14.1 Gbps (series information in the device datasheet).

Typical Applications

• High‑density digital processing  Use the large pool of logic elements and logic blocks for complex FPGA-based datapaths, algorithm acceleration, and custom processing engines.
• On‑chip buffering and memory‑intensive tasks  Approximately 51.2 Mbits of embedded memory supports deep FIFOs, frame buffering, and lookup tables without reliance on external RAM.
• I/O‑intensive systems  The 600 I/Os enable support for wide parallel interfaces, multiple peripherals, and high pin-count interconnects on dense boards.
• Commercial embedded systems  The commercial temperature grade and package options suit control, communications, and processing applications operating within 0 °C to 85 °C.

Unique Advantages

• Extensive programmable fabric: With 622,000 logic elements and 234,720 logic blocks, the device supports large-scale, complex designs without partitioning across multiple chips.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency and simplifies board-level BOM and layout.
• High I/O count: 600 I/Os let designers implement broad external interfacing and parallel data paths, simplifying integration with multi-channel systems.
• Compact BGA package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package enables high-density board layouts while maintaining signal integrity and routing options.
• Series-level high-speed transceivers: Stratix V GX series documentation includes transceiver speed grades up to 14.1 Gbps, which is relevant when selecting devices for high-speed serial links (see device datasheet for series details).
• RoHS compliant: Meets common environmental requirements for streamlined compliance in commercial products.

Why Choose 5SGXMA7N2F40C3?

The 5SGXMA7N2F40C3 is positioned for commercial embedded designs that require high logic capacity, large on‑chip memory, and a high number of I/Os in a compact BGA package. Its documented core and I/O resources make it suitable for integrators needing to consolidate functionality onto a single FPGA to reduce board-level complexity.

Backing from the Stratix V GX device family documentation provides series-level details—such as transceiver speed grade options—for designers evaluating connectivity and performance trade-offs. For teams focused on scalable, high‑integration FPGA solutions within commercial temperature ranges, this device delivers verifiable on‑chip resources and a clear package and power profile for system planning.

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