5SGXMA7N2F40C3G

The 5SGXMA7N2F40C3G is a Stratix V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package. It delivers very high logic density and on-chip memory along with a large I/O count for complex digital designs.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 600 device I/O pins, this commercial-grade FPGA is intended for high‑performance digital and multi‑I/O applications that require substantial integration and flexible I/O routing.

Key Features

• Logic Capacity  622,000 logic elements to implement large-scale digital designs and complex FPGA architectures.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and high-throughput data paths.
• I/O Density  600 device I/O pins to support wide parallel interfaces and multiple external peripherals.
• Transceiver Capability  Stratix V GX family transceiver speed grades are supported by the series (family datasheet shows GX channel speeds up to 14.1 Gbps), enabling multi‑gigabit serial links where required.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV for the device core.
• Package & Mounting  1517-BBGA (FCBGA) supplier package 1517-FBGA (40×40); surface-mount device suitable for board-level integration.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High‑speed communications  Leverage the Stratix V GX transceiver grades and 600 I/O pins to implement multi‑gigabit links and protocol bridging in networking equipment.
• Signal processing and acceleration  High logic density and extensive embedded RAM make the device suitable for DSP pipelines, packet processing, and algorithm acceleration.
• Large-scale digital systems  Use for complex state machines, wide parallel interfaces, and system glue logic where high gate count and memory are required.

Unique Advantages

• High integration density: 622,000 logic elements reduce external components and consolidate functionality on a single device.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering, LUTs, and on‑chip data structures to accelerate designs.
• Extensive I/O capability: 600 device I/O pins enable broad peripheral connectivity and complex board-level interfaces without external expanders.
• Multi‑gigabit transceiver support: Family-level GX transceiver speed grades (up to 14.1 Gbps in the Stratix V GX family) provide options for high-speed serial links.
• Commercial temperature suitability: Specified for 0 °C to 85 °C operation for mainstream electronic and embedded applications.
• Industry‑standard packaging: 1517-BBGA (1517-FBGA, 40×40) surface-mount package simplifies PCB layout and assembly for high‑density designs.

Why Choose 5SGXMA7N2F40C3G?

The 5SGXMA7N2F40C3G places a very high logic element count and significant on‑chip memory in a compact FCBGA package, delivering the integration needed for advanced digital systems. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 600 I/O pins makes it well suited to demanding applications that require large logic fabrics, substantial memory bandwidth, and broad external connectivity.

As a commercial‑grade Stratix V GX device, it aligns with designs that need a balance of performance and integration while conforming to a defined operating voltage and temperature envelope. Designers targeting high‑density FPGA implementations, multi‑I/O subsystems, or projects that leverage Stratix V GX transceiver capabilities will find this part a practical option.

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