5SGXMA7N2F40C3WN

The 5SGXMA7N2F40C3WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA surface-mount package. It delivers very large programmable logic capacity together with substantial embedded memory and a high I/O count for complex, high-density digital designs.

As a commercial-grade device (0 °C to 85 °C) with RoHS compliance and a core supply range of 820 mV to 880 mV, this Stratix V GX part is intended for applications that require extensive logic resources, large on-chip RAM, and broad I/O connectivity within the commercial temperature range.

Key Features

• Logic Capacity  622,000 logic elements (LEs) for implementing large, complex digital functions and wide parallel processing.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, large state machines, and memory‑intensive logic.
• I/O Density  600 user I/Os to accommodate extensive external interfaces and high-pin-count system designs.
• Package & Mounting  1517‑BBGA (1517‑FBGA, 40 × 40) FCBGA surface-mount package for compact, high‑density board integration.
• Power  Core voltage supply range of 820 mV to 880 mV to match low-voltage core domains.
• Temperature & Grade  Commercial grade, rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead‑free assemblies.

Typical Applications

• High-density programmable logic systems  Implement large-scale custom logic, parallel processors, and complex control functions using the device's extensive logic and memory resources.
• Data buffering and on-chip memory acceleration  Use the approximately 51.2 Mbits of embedded RAM for packet buffering, LUT-based caches, and memory-intensive algorithms.
• High-pin-count interface aggregation  Leverage 600 I/Os to consolidate multiple external interfaces or to support wide data buses and multi-channel connectivity.

Unique Advantages

• Extensive logic resources: 622,000 logic elements enable consolidation of multi-module systems onto a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency and lowers overall system latency.
• High I/O capacity: 600 I/Os simplify connectivity for multi-peripheral or multi-channel applications without sacrificing routing flexibility.
• Space-efficient package: The 1517‑BBGA FCBGA package supports high-density PCB designs while providing robust electrical connectivity for complex systems.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, suitable for standard commercial environments where controlled temperature operation is expected.
• Standards-conscious compliance: RoHS compliance helps meet environmental regulatory requirements for lead-free production.

Why Choose 5SGXMA7N2F40C3WN?

The 5SGXMA7N2F40C3WN positions itself as a high-capacity Stratix V GX FPGA for designs that demand large programmable logic, significant embedded memory, and broad I/O connectivity within a commercial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 600 user I/Os enables consolidation of complex subsystems and reduces the need for external components.

Backed by Intel's Stratix V device documentation and offered in a 1517‑BBGA surface-mount package with RoHS compliance, this device is suited to engineering teams targeting dense, high‑functionality digital designs that prioritize integration and proven device-level specifications.

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