5SGXMA7N2F40I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 955 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N2F40I2N – Stratix® V GX FPGA, 622,000 logic elements, approximately 51.2 Mbits RAM, 600 I/O
The 5SGXMA7N2F40I2N is an Intel Stratix V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers a high logic capacity, abundant on‑chip memory and a large I/O complement for complex, high‑density digital designs.
Offered in an industrial temperature grade and designed for surface‑mount deployment, this device targets applications that require robust operation across a wide temperature range while maintaining low core voltage operation.
Key Features
- Core capacity — Logic elements: 622,000 logic elements provide substantial programmable logic for large designs and complex routing requirements.
- Embedded memory: Approximately 51.2 Mbits of on‑chip RAM to support large buffering, lookup tables and mid‑level memory requirements without external RAM.
- I/O density: 600 user I/O pins to support extensive interfacing, parallel buses and multiple peripheral connections.
- Package and mounting: 1517‑BBGA (1517‑FBGA, 40×40) FCBGA package designed for surface‑mount PCB assembly.
- Power supply: Core voltage range specified at 870 mV to 930 mV for low‑voltage core operation.
- Temperature and grade: Industrial grade with operating temperature from −40 °C to 100 °C for reliable performance in demanding environments.
- Manufacturer: Intel (Altera Stratix V family), with device documentation and family data available from the Stratix V device datasheet.
Unique Advantages
- High programmable density: 622,000 logic elements enable consolidation of multiple functions onto a single FPGA, reducing system complexity.
- Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory and simplifies board layout.
- Extensive I/O availability: 600 I/Os support diverse interfaces and parallel connections, making the device adaptable to complex system topologies.
- Industrial temperature range: Rated for −40 °C to 100 °C operation to support designs that require extended environmental tolerance.
- Compact FCBGA package: The 1517‑BBGA (40×40) package balances high pin count with a compact footprint for dense board designs.
- Low core voltage: 870 mV–930 mV supply range supports efficient core power domains and modern low‑voltage system architectures.
Why Choose 5SGXMA7N2F40I2N?
The 5SGXMA7N2F40I2N combines high logic density, substantial embedded memory and a large I/O complement in a rugged industrial‑grade Stratix V GX package. These characteristics make it suitable for advanced digital designs that require integrated resources and durable operation across a wide temperature range.
Backed by Intel’s Stratix V family documentation and delivered in a compact 1517‑BBGA FCBGA form factor, this device offers a scalable platform for teams looking to integrate complex logic, on‑chip memory and broad interfacing capabilities into a single FPGA solution.
Request a quote or submit an order inquiry to evaluate the 5SGXMA7N2F40I2N for your next design project.

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