5SGXMA7N2F40I3LN

The 5SGXMA7N2F40I3LN is a Stratix V GX field programmable gate array (FPGA) offered by Intel. It delivers high logic density and substantial embedded memory in a surface-mount FCBGA package aimed at industrial applications requiring robust thermal and electrical performance.

As a member of the Stratix V GX family, this device is documented in the Stratix V device datasheet and is suitable for designs that need large programmable logic capacity, abundant I/O, and industrial temperature operation.

Key Features

• Core Logic — 622,000 logic elements to support complex FPGA implementations and large-scale programmable designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, large state machines, and data storage within the fabric.
• I/O Capacity — 600 general-purpose I/Os to accommodate wide parallel interfaces and dense connectivity requirements.
• Package and Mounting — 1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
• Power Supply — Core supply range of 820 mV to 880 mV to match platform power delivery requirements.
• Thermal and Grade — Industrial temperature grade rated from –40°C to 100°C for deployment in demanding environmental conditions.
• Regulatory — RoHS-compliant.

Typical Applications

• High-density signal processing — Use the large logic element count and embedded memory to implement complex DSP pipelines and packet-processing engines.
• High-speed communications systems — As a Stratix V GX family device, the series supports transceiver-grade operation (see device datasheet) suitable for high-bandwidth link and networking functions.
• Industrial control and automation — Industrial temperature rating and extensive I/O make this device suitable for robust control systems and factory automation designs.
• Advanced prototyping and system integration — High logic density and abundant I/O support integration of multiple subsystems onto a single FPGA for system-level validation and consolidation.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 51.2 Mbits of RAM reduces reliance on external memory for many buffering and storage tasks, simplifying system design.
• Ample I/O resources: 600 I/Os provide the flexibility to interface with multiple high-pin-count peripherals and parallel buses without external expander chips.
• Industrial-ready thermal performance: Rated for –40°C to 100°C operation to support deployments in harsh or temperature-variable environments.
• Compact surface-mount package: 1517-BBGA FCBGA package supports high-density board layouts while maintaining manufacturability.
• RoHS compliant: Conforms to RoHS requirements for environmentally restricted substances.

Why Choose 5SGXMA7N2F40I3LN?

The 5SGXMA7N2F40I3LN combines a very high logic element count, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA. Its documented device characteristics in the Stratix V datasheet and robust package and thermal ratings make it well suited for engineers designing large, integrated digital systems that demand reliability and density.

This part is appropriate for teams building high-performance communication, processing, and control systems that require long-term product stability and detailed electrical documentation for system design and validation.

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