5SGXMA7N2F40I3WN

The 5SGXMA7N2F40I3WN is an Intel Stratix® V GX family FPGA delivered in a 1517-ball BGA (FCBGA) surface-mount package. It combines very high logic density and extensive I/O with industrial temperature grading and on-chip embedded memory to support demanding system designs.

This device is well suited for designs that require large programmable logic capacity, substantial on-chip RAM, and a high count of I/O signals—making it applicable to high-performance communications, compute acceleration, and industrial systems where operating range and integration matter.

Key Features

• Core density — 622,000 logic elements provide substantial programmable logic capacity for complex designs and high parallelism.
• Logic array blocks — 234,720 logic array blocks (LABs) for structured logic implementation and routing.
• Embedded memory — Approximately 51.2 Mbits of embedded memory for large on-chip buffers, FIFOs, and data storage.
• High I/O count — 600 I/Os to support wide parallel interfaces, high-pin-count peripherals, and multi-channel connectivity.
• Supply voltage — Core voltage range from 820 mV to 880 mV, enabling defined power domain planning.
• Temperature and grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for robust operation in industrial environments.
• Package & mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA, surface-mount package suitable for board-level integration where high-density BGA is required.
• Standards compliance — RoHS compliant to meet current environmental requirements.
• Family transceiver capability (series-level) — Stratix V GX family documentation lists transceiver speed grades available across the family, informing system-level bandwidth planning.

Typical Applications

• High-performance networking — Use the device’s large logic capacity and high I/O count for packet processing, switching fabric, and protocol offload functions.
• Data center acceleration — Implement custom accelerators, data-path processing, and buffering leveraging the device’s extensive embedded memory and logic resources.
• Broadcast and video processing — Support multi-channel video pipelines and real-time processing tasks with abundant logic and on-chip RAM.
• Industrial control and automation — Industrial-grade temperature range and high I/O count enable robust control, signal aggregation, and I/O-intensive applications.

Unique Advantages

• High programmable density: 622,000 logic elements let you implement complex algorithms and wide-parallel datapaths without partitioning across multiple devices.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and accelerates deterministic data handling.
• Extensive I/O capability: 600 general-purpose I/Os simplify system integration for multi-channel interfaces and high-pin-count peripherals.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in temperature-variable industrial environments.
• Compact, high-density package: 1517-ball FCBGA supports board-level integration where mechanical density and thermal considerations are critical.
• Regulatory alignment: RoHS compliance aligns with current environmental and manufacturing requirements.

Why Choose 5SGXMA7N2F40I3WN?

This Stratix V GX FPGA offers a combination of high logic density, substantial embedded memory, and a large I/O complement in an industrial-grade BGA package—providing a solid platform for systems that demand on-chip capacity and robust operation. It is positioned for teams building high-throughput communications, compute acceleration, and industrial-control solutions that require scalable programmable logic and integrated memory.

Choosing this device supports designs that need long-term scalability and integration, backed by the Stratix V family documentation and Intel device support. The package, voltage range, and temperature rating enable careful power and thermal planning for production deployments.

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