5SGXMA7N2F45C1G

The 5SGXMA7N2F45C1G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-ball BGA FCBGA package intended for commercial use. It combines a large logic fabric, substantial embedded memory, and high I/O density to address complex digital processing and high-speed serial applications.

Key value propositions include high logic capacity, approximately 51.2 Mbits of embedded RAM, and broad I/O count, all supplied at a core voltage range of 870 mV to 930 mV and rated for commercial operating temperatures.

Key Features

• Logic Capacity  622,000 logic elements to support large-scale, complex designs and dense implementation of custom logic.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, large on-chip data structures, and state storage.
• High I/O Count  840 I/O pins to enable dense interfacing with peripherals, memory, and multi-channel data paths.
• Transceiver Capability (Series)  Stratix V GX family transceiver speed grades are documented in the device series datasheet, with GX channel speed grades listed up to 14.1 Gbps in applicable speed grades.
• Power and Operating Voltage  Core supply voltage specified between 870 mV and 930 mV to match system power budgeting and regulator selection.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial-class deployments.
• Package and Mounting  Surface-mount 1932-ball BGA (FCBGA) package; supplier device package noted as 1932-FBGA, FC (45×45) for board-level integration and mechanical planning.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly and regulatory alignment.

Typical Applications

• High-speed serial systems  Suitable for designs that leverage Stratix V GX transceiver speed grades for multi-gigabit channels as documented in the series datasheet.
• Compute-intensive custom logic  Large logic element count and embedded RAM enable implementation of complex signal processing, packet processing, or control engines.
• High-density I/O integration  840 I/O pins allow dense peripheral interfaces, multi-lane memory interfaces, and broad system connectivity.
• Commercial embedded systems  Designed for applications operating in commercial temperature environments that require significant on-chip resources.

Unique Advantages

• Substantial on-chip resources: 622,000 logic elements combined with approximately 51.2 Mbits of RAM reduce reliance on external logic and memory, simplifying system BOMs.
• High I/O density: 840 I/O supports complex, multi-interface systems and minimizes external multiplexing or glue logic.
• Commercial-grade operating range: Rated 0 °C to 85 °C for predictable performance in commercial deployments.
• Defined core voltage window: 870 mV to 930 mV supply range provides clear requirements for power-supply design and thermal/power budgeting.
• RoHS compliance: Meets environmental standards for modern assembly processes and regulatory alignment.
• Package scale for dense PCB designs: 1932-BBGA (supplier: 1932-FBGA, FC 45×45) supports compact, high-pin-count board layouts.

Why Choose 5SGXMA7N2F45C1G?

The 5SGXMA7N2F45C1G targets designs that require a high logic count, significant embedded memory, and substantial I/O capability within a commercial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/O make it suitable for dense system integration and advanced digital processing tasks where on-chip resources reduce external components.

Backed by the Stratix V GX device family documentation and RoHS compliance, this FPGA offers a well-defined electrical and package specification set—facilitating power supply design, thermal planning, and PCB integration for procurement and engineering teams focused on high-capacity commercial FPGA solutions.

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