5SGXMA7N2F45C2

The Intel Stratix® V GX Field Programmable Gate Array (FPGA) 5SGXMA7N2F45C2 delivers high on-chip logic capacity, a large embedded memory footprint, and a high I/O count in a 1932-BBGA FCBGA surface-mount package. This commercial-grade device is specified with a voltage supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key device metrics include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 user I/Os, making the part suitable where dense programmable logic and extensive I/O are required within commercial-temperature designs.

Key Features

• Logic capacity — 622,000 logic elements and 234,720 logic blocks provide a large programmable fabric for complex logic implementations.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for local buffering, data storage, and algorithm implementation.
• I/O density — 840 user I/Os to support extensive external interfacing and system integration.
• Power requirement — Voltage supply specified from 870 mV to 930 mV to match system power delivery design.
• Package & mounting — 1932-BBGA FCBGA surface-mount package; supplier package listed as 1932-FBGA FC (45×45) for compact board-level integration.
• Temperature & grade — Commercial grade with operating temperature range 0 °C to 85 °C.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-density programmable logic systems — Use the large logic element count and extensive block structure for complex digital designs that require significant on-chip logic resources.
• Data buffering and memory-heavy functions — Approximately 51.2 Mbits of embedded RAM supports on-chip buffering, FIFOs, and memory-intensive algorithms.
• Complex I/O aggregation and interfacing — 840 I/Os enable integration with numerous peripherals, sensors, and board-level interfaces in commercial electronics.
• Transceiver-enabled system designs — Part of the Stratix V GX family whose documentation covers transceiver and switching characteristics for designs that include high-speed serial interfaces.

Unique Advantages

• High on-chip integration: Large logic and memory resources consolidate functionality into a single device footprint.
• Extensive connectivity: 840 I/Os reduce the need for external I/O expanders and simplify board-level routing for complex systems.
• Compact FCBGA package: 1932-BBGA package provides a high pin-count solution in a compact surface-mount form factor.
• Commercial-temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial electronics deployments.
• RoHS compliant: Environmental compliance supports regulatory and manufacturing requirements.
• Controlled core supply range: Defined 870 mV–930 mV voltage supply simplifies power-supply design and verification.

Why Choose 5SGXMA7N2F45C2?

5SGXMA7N2F45C2 positions itself as a high-density Stratix® V GX FPGA option for commercial designs that require a large programmable fabric, substantial embedded memory, and a high number of I/Os in a single-package solution. The combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os in a 1932-BBGA FCBGA package supports compact, integrated system designs.

This device is appropriate for engineers and teams developing commercial-temperature applications that benefit from consolidated logic, extensive memory resources, and broad interfacing capability, with RoHS compliance and well-defined electrical and thermal operating parameters.

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