5SGXMA7N2F45C2LG

The 5SGXMA7N2F45C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. This high-density FPGA integrates 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM, delivering the capacity needed for complex digital designs.

Packaged in a 1932‑BBGA (FCBGA) surface‑mount package and providing 840 I/O pins, the device is specified for commercial‑grade operation from 0 °C to 85 °C and a core supply range of 0.820–0.880 V, suitable for demanding I/O‑dense and memory‑intensive applications.

Key Features

• Core FPGA Fabric  622,000 logic elements provide abundant programmable fabric for implementing complex algorithms, pipelines, and control logic.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM supports large buffering, packet storage, and working memory for data‑intensive operations.
• I/O Density  840 I/O pins enable extensive external interface integration and high connector/board routing density.
• Package & Mounting  1932‑BBGA FCBGA (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor for high‑density board designs.
• Power  Core supply operating range of 0.820 V to 0.880 V to match system power designs and power sequencing requirements.
• Operating Conditions & Grade  Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑performance digital processing  Use the large logic capacity and embedded RAM to implement complex signal processing, compute pipelines, and algorithm acceleration.
• Dense I/O systems  840 I/Os support multi‑lane interfaces, multi‑sensor aggregation, and high‑channel‑count peripheral connectivity.
• Prototyping and custom hardware  The surface‑mount 1932‑BBGA package enables integration into compact, production‑grade prototypes and custom boards.
• Commercial embedded systems  Commercial temperature rating and robust on‑chip memory make the device suitable for a wide range of embedded applications operating within 0 °C to 85 °C.

Unique Advantages

• Substantial logic capacity: 622,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Significant embedded memory: Approximately 51.2 Mbits of on‑chip RAM provides the headroom for buffering, caching, and state storage without external memory.
• High I/O count: 840 I/Os simplify interfacing to dense connector arrays and multi‑channel subsystems, minimizing external multiplexing.
• Compact, high‑density packaging: The 1932‑BBGA FCBGA package supports high pin counts in a compact footprint for space‑constrained designs.
• Commercial availability: Specified commercial temperature grade and RoHS compliance support broad production deployment in commercial products.

Why Choose 5SGXMA7N2F45C2LG?

The 5SGXMA7N2F45C2LG combines high logic density, substantial embedded RAM, and a large I/O complement in a compact 1932‑BBGA package, positioning it for designs that require consolidated functionality, extensive interfacing, and significant on‑chip memory. Its commercial temperature rating and Intel Stratix V family documentation support integration into production commercial systems.

For development teams and systems integrators targeting high‑capacity programmable logic with dense I/O and large embedded memory, this Stratix V GX device delivers a balanced platform for implementation, integration, and scale within commercial product environments.

Request a quote or submit an inquiry to purchase 5SGXMA7N2F45C2LG today and discuss availability and lead time for your design requirements.