5SGXMA7N2F45C2WN

The 5SGXMA7N2F45C2WN is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel (Altera). It delivers large-scale programmable logic and on-chip memory in a high-pin-count, surface-mount package suited for commercial temperature applications.

With 622,000 logic element cells, approximately 51.2 Mbits of embedded RAM, and 840 user I/Os, this device targets complex digital systems that require dense logic, substantial on-chip memory, and broad I/O connectivity while operating within a commercial temperature range.

Key Features

• Core Logic  622,000 logic element cells for extensive programmable logic capacity.
• Embedded Memory  Total on-chip RAM of approximately 51.2 Mbits to support large buffers, FIFOs, and memory-intensive functions.
• I/O Density  840 general-purpose I/Os to accommodate high pin-count interfaces and multi-channel connectivity.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45 mm). Surface mount mounting type.
• Power  Core voltage supply range: 870 mV to 930 mV, enabling defined power sequencing and supply planning.
• Thermal & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and abundant on-chip RAM make this FPGA suitable for complex logic implementations and custom datapaths.
• Multi‑interface systems  Extensive I/O count supports designs that require many parallel interfaces or mixed signal routing to external devices.
• Memory‑intensive functions  Approximately 51.2 Mbits of embedded RAM supports buffering, packet processing, and on-chip data staging without immediate external memory dependence.

Unique Advantages

• High logic capacity: 622,000 logic element cells enable integration of large, multi-module designs into a single device, reducing PCB complexity.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory lowers external memory requirements for many use cases.
• Extensive I/O connectivity: 840 I/Os provide flexibility for dense board-level integration and multiple peripheral interfaces.
• Compact, high-density package: 1932-FBGA (45×45 mm) packaging delivers high pin count in a surface-mount form factor for space-constrained designs.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for typical commercial environments.
• RoHS compliance: Aligns with lead-free and restricted-substance requirements for compliant production.

Why Choose 5SGXMA7N2F45C2WN?

This Stratix® V GX device combines a high logic element count, large embedded memory, and a very high I/O complement in a single, surface-mount FCBGA package—delivering a compact, integrated platform for complex digital systems within commercial operating conditions. It is appropriate for engineers seeking to consolidate multi-component designs into a single FPGA with predictable power and thermal parameters.

Backed by Intel (Altera) documentation and datasheet support, the 5SGXMA7N2F45C2WN is positioned for designs that require scalability and long-term availability from an established FPGA family.

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