5SGXMA7N2F45C2N

The 5SGXMA7N2F45C2N is a Stratix® V GX field programmable gate array (FPGA) from Intel, provided in a 1932-BBGA FCBGA package. It combines high programmable logic capacity with substantial embedded memory and a large I/O count, and is offered as a commercial-grade device.

With a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C, this device is intended for designs that require significant on-chip resources and extensive external connectivity while adhering to commercial temperature requirements.

Key Features

• Core Logic  622,000 logic elements providing extensive programmable logic capacity for complex digital designs.
• Logic Array Blocks  234,720 logic array blocks for structured logic partitioning and resource allocation.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, intermediate storage, and memory-intensive functions.
• I/O Capacity  840 user I/O pins to accommodate multiple external interfaces and high pin-count systems.
• Power  Core voltage supply specified from 870 mV to 930 mV for predictable power planning and supply design.
• Package  1932-ball BGA FCBGA package (supplier device package: 1932-FBGA, FC, 45×45 mm) for high-density board integration.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting standard lead-free requirements for environmental compliance.

Typical Applications

• High-density programmable logic  Implement large-scale finite state machines, datapaths, or custom processors that require extensive logic resources and on-chip memory.
• I/O-rich systems  Drive systems that need many external interfaces or parallel connections thanks to the device's 840 I/O pins.
• Memory-intensive functions  Use the approximately 51.2 Mbits of embedded RAM for buffering, packet memory, or intermediate data storage in complex algorithms.
• Platform integration  Integrate into compact, high-density boards using the 1932-BBGA package for space-constrained designs.

Unique Advantages

• High programmable capacity: 622,000 logic elements provide ample resources to implement complex custom logic without immediate part upgrades.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory for many use cases, simplifying BOM and board layout.
• Extensive I/O availability: 840 I/O pins allow flexible interfacing to peripherals, sensors, and parallel subsystems.
• Compact, high-density packaging: 1932-ball FCBGA package enables high-pin-count integration in constrained PCB footprints.
• Predictable power domain: Narrow core voltage window (870 mV–930 mV) aids in power-supply design and thermal planning.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose 5SGXMA7N2F45C2N?

The 5SGXMA7N2F45C2N positions itself where high on-chip logic capacity, significant embedded memory, and large I/O count are required in a commercial-grade FPGA. Its combination of 622,000 logic elements, roughly 51.2 Mbits of RAM, and 840 I/O pins enables designers to consolidate complex functions on a single device while maintaining a compact board footprint using the 1932-BBGA package.

Backed by Intel's Stratix V family documentation, this device is suited for engineering teams and procurement focused on scalable designs that leverage substantial programmable resources and high I/O density within commercial temperature limits.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the 5SGXMA7N2F45C2N.