5SGXMA7N2F45C2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 166 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N2F45C2G – Stratix® V GX FPGA, 622,000 logic elements, approximately 51.2 Mbits RAM, 840 I/O, 1932‑BBGA

The 5SGXMA7N2F45C2G is a Stratix® V GX field programmable gate array (FPGA) from Intel, built for commercial applications requiring large logic capacity and substantial on‑chip memory. This device combines 622,000 logic elements with approximately 51.2 Mbits of embedded RAM and 840 general‑purpose I/O to enable complex, high‑density designs in a 1932‑ball BGA surface‑mount package.

Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance, the part targets applications that require broad I/O connectivity and significant programmable logic and memory resources within a single FPGA footprint.

Key Features

  • Core Logic 622,000 logic elements (cells) provide a large programmable fabric for complex digital designs and system integration.
  • Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage without external memory dependency.
  • I/O Density 840 available I/O pins to support wide parallel interfaces, numerous peripherals, and board-level signal routing options.
  • Package & Mounting 1932‑BBGA (FCBGA) package, supplier package listed as 1932‑FBGA, FC (45×45), designed for surface‑mount assembly.
  • Power Supply Specified core voltage range from 0.870 V to 0.930 V to match platform power‑rail requirements.
  • Operating Conditions & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance RoHS‑compliant status for environmental and regulatory considerations.

Typical Applications

  • Complex FPGA-based Prototyping — Large logic capacity and abundant embedded RAM make the device suitable for high‑density prototype systems and ASIC emulation tasks.
  • Data Acquisition & Imaging — High I/O count and substantial on‑chip memory support parallel sensor interfaces, buffering, and preprocessing pipelines.
  • Protocol Bridging & Interface Aggregation — 840 I/O enable integration of multiple serial and parallel interfaces for protocol conversion and system glue logic.
  • Compute Acceleration — Significant logic and local RAM resources allow implementation of custom compute kernels and hardware accelerators within a single FPGA.

Unique Advantages

  • Large, Programmable Logic Fabric: 622,000 logic elements enable integration of complex state machines, DSP blocks, and custom processing pipelines on a single device.
  • Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for temporary storage and streaming applications.
  • Extensive I/O Count: 840 I/O pins offer broad connectivity for multi‑channel interfaces and high‑pin‑count system designs.
  • High‑Density BGA Package: 1932‑BBGA in a 45×45 supplier footprint supports compact board layouts while providing the pin count required for complex systems.
  • Commercial Temperature & RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance simplify integration into commercial product lines.

Why Choose 5SGXMA7N2F45C2G?

The 5SGXMA7N2F45C2G positions itself as a high‑capacity Stratix V GX FPGA for commercial designs that require a combination of significant logic resources, embedded memory, and a very large I/O count in a single surface‑mount BGA package. Its power and temperature specifications make it straightforward to integrate into commercial boards that match the listed supply and thermal envelope.

For engineers and system designers building complex FPGA-centric subsystems—such as advanced prototyping platforms, multi‑channel data capture, or dense interface aggregation—the 5SGXMA7N2F45C2G delivers the on‑chip resources necessary to consolidate functionality and reduce external component count.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the 5SGXMA7N2F45C2G.

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