5SGXMA7N2F45C2LN

The 5SGXMA7N2F45C2LN is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1932-pin FCBGA package for surface-mount assembly. It delivers high on-chip logic density and embedded memory with a large I/O count to support complex digital designs.

Designed for commercial-temperature applications, this device targets designs that require substantial logic capacity, significant embedded RAM, and extensive I/O connectivity while operating within a core voltage range of 820 mV to 880 mV.

Key Features

• Logic Density 622,000 logic elements provide substantial resources for implementing large digital systems and complex algorithms.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, data storage, and high-throughput processing on chip.
• I/O Capacity 840 I/Os to support extensive peripheral connectivity, parallel interfaces, and board-level integration.
• Core Architecture & Speed Grades Stratix V GX family characteristics are reflected in this part’s architecture; consult the device datasheet for details on available speed grades and transceiver options.
• Power and Voltage Core voltage supply range of 820 mV to 880 mV for the FPGA core domain.
• Package & Mounting 1932-BBGA (FCBGA) package case; supplier device package listed as 1932-FBGA, FC (45x45). Surface-mount mounting type.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• High-density digital systems — Implement complex FPGA designs that require hundreds of thousands of logic elements and large embedded RAM capacity.
• Multi-interface platforms — Use the large I/O count to aggregate parallel and serial interfaces on a single device.
• Memory-intensive processing — Deploy approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and temporary data storage.

Unique Advantages

• Substantial logic capacity: 622,000 logic elements enable large-scale integration of digital functions without immediate reliance on external logic chips.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory bandwidth needs and simplifies board-level memory design.
• High I/O count: 840 I/Os provide flexibility for dense connector and peripheral configurations, minimizing the need for external I/O expanders.
• Commercial temperature fit: Rated for 0 °C to 85 °C operation for deployments in commercial-grade systems and environments.
• Surface-mount FCBGA package: 1932-BBGA package supports compact board layouts and automated assembly processes.
• Regulatory alignment: RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose 5SGXMA7N2F45C2LN?

The 5SGXMA7N2F45C2LN combines high logic density, substantial embedded RAM, and a large I/O complement in a single commercial-grade Stratix V GX FPGA package. It is well-suited to designers who need to consolidate complex digital functions, memory buffering, and extensive interfacing into one programmable device while operating in standard commercial environments.

This part offers a balance of integration and scalability for medium- to high-complexity FPGA designs. Its package and mounting support production-ready surface-mount assembly, and RoHS compliance helps meet modern environmental requirements.

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