5SGXMA7N2F45C3

The 5SGXMA7N2F45C3 is a Stratix V GX field programmable gate array (FPGA) IC designed for high-density programmable logic applications. It combines a large logic fabric with substantial on-chip RAM and a high I/O count to address complex digital designs that require significant integration and connectivity.

Offered as a commercial-grade device, this Stratix V GX part provides designers with a compact, surface-mount solution in a 1932-BBGA (FCBGA) package suitable for systems that demand large programmable resources and broad I/O capability.

Key Features

• Logic Capacity — 622,000 logic elements provide extensive programmable logic resources for complex designs and large-scale integration.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, large LUT-based functions, and state storage within the FPGA fabric.
• I/O Density — 840 user I/O pins to accommodate wide external interfacing and high-pin-count system topologies.
• Power — Core voltage supply range of 820 mV to 880 mV for the device core operating domain.
• Package & Mounting — 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact board-level integration.
• Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards — RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic element count and on-chip RAM to implement complex state machines, DSP pipelines, or custom accelerators.
• Multi‑I/O systems — Leverage 840 I/Os for boards requiring extensive parallel interfaces, wide buses, or numerous peripheral connections.
• Data buffering and packet processing — Embedded memory capacity supports on-chip buffering and packet handling in communication or data acquisition systems.

Unique Advantages

• Substantial programmable fabric — 622,000 logic elements enable large designs to be implemented in a single FPGA, reducing board-level component count.
• Significant on-chip RAM — Approximately 51.2 Mbits of embedded memory supports deep buffering and complex data path implementations without external RAM.
• High I/O count for system integration — 840 I/Os simplify routing of sensors, peripherals, and external interfaces directly to the FPGA fabric.
• Compact package — 1932-BBGA FCBGA in a 45×45 supplier package provides a high-density mounting option for space-constrained designs.
• Commercial qualification — Commercial-grade device rating and specified 0 °C to 85 °C operating range for standard commercial deployments.
• Regulatory compliance — RoHS compliance aligns with common environmental requirements for electronics manufacturing.

Why Choose 5SGXMA7N2F45C3?

The 5SGXMA7N2F45C3 positions itself as a high-capacity, commercial-grade Stratix V GX FPGA ideal for designs that need large logic resources, ample on-chip memory, and extensive I/O connectivity in a compact surface-mount BGA package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/Os makes it well suited to consolidate complex functions into a single programmable device and simplify board-level design.

Choose this FPGA when you require a scalable, high-density programmable solution backed by the Stratix V GX family specifications, with clear operating and power parameters for reliable integration into commercial electronic systems.

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