5SGXMA7N2F45I2G

The 5SGXMA7N2F45I2G is an Intel Stratix® V GX field programmable gate array (FPGA) delivered in a 1932-ball-grid FCBGA package for surface-mount assembly. Designed for industrial-temperature applications, it combines very large logic capacity, plentiful I/O, and substantial embedded RAM to support complex, high‑density designs.

With 622,000 logic elements and approximately 51.2 Mbits of on‑chip RAM, this device targets designs that require extensive programmable logic, high I/O count, and robust operation across –40 °C to 100 °C. The device’s low core-voltage operating window supports modern power-optimized architectures.

Key Features

• Logic Capacity  622,000 logic elements for implementing large, complex digital designs and state machines.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support buffering, lookup tables, and local data storage.
• I/O Resources  840 user I/Os to interface with high-pin-count peripherals, multi-lane buses, and dense connectivity requirements.
• Power and Core Supply  Core voltage specified from 870 mV to 930 mV to match low-voltage, high-performance FPGA power domains.
• Package and Mounting  Surface-mount 1932‑BBGA (FCBGA) package; supplier package listed as 1932‑FBGA, FC (45×45) for compact, high‑pin‑count board designs.
• Industrial Grade  Rated for industrial temperature operation from –40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant to meet regulatory and manufacturing requirements.

Typical Applications

• High‑density signal processing  Large logic and embedded RAM make this FPGA suitable for compute‑intensive DSP pipelines and real‑time data processing.
• Networking and communications  High I/O count and extensive logic resources accommodate complex protocol interfaces, packet processing, and multi‑lane connectivity.
• Industrial control and automation  Industrial temperature rating and robust packaging support factory and process control systems requiring reliable, long‑term operation.
• Hardware acceleration  Substantial logic and memory resources enable hardware offload of compute kernels and custom acceleration functions.

Unique Advantages

• Extensive programmable resources: 622,000 logic elements and large embedded memory reduce reliance on external components for complex logic and buffering.
• High connectivity: 840 I/Os provide the flexibility to interface with a wide variety of sensors, transceivers, and high‑pin-count peripherals without external multiplexing.
• Industrial robustness: Rated for –40 °C to 100 °C, enabling deployment in industrial and demanding thermal environments.
• Compact, high‑pin package: 1932‑BBGA (FCBGA) packaging delivers high density in a board‑level footprint optimized for surface‑mount assembly.
• Low core-voltage operation: Core supply range of 870–930 mV aligns with modern low-voltage system power architectures to support efficient designs.
• Standards‑aligned manufacturing: RoHS compliance simplifies integration into regulated product supply chains.

Why Choose 5SGXMA7N2F45I2G?

The 5SGXMA7N2F45I2G positions itself where high logic density, large embedded memory, and extensive I/O are required within industrial-temperature applications. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on‑chip RAM, and 840 I/Os makes it well suited for designers implementing complex data paths, protocol engines, or hardware acceleration blocks while minimizing external components.

As a Stratix® V GX device from Intel, it is part of a family documented in a dedicated device datasheet and specified for industrial operation, providing the clarity needed for system design, thermal planning, and supply‑chain compliance.

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