5SGXMA7N2F45I2WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,472 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N2F45I2WN – Stratix® V GX Field Programmable Gate Array (FPGA), 622000 logic elements, 840 I/Os
The 5SGXMA7N2F45I2WN is a Stratix V GX family FPGA in a 1932-BBGA FCBGA package, designed for high-density programmable logic implementations. The device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and an 840-pin I/O fabric, and is offered in an industrial temperature grade.
Key on-chip attributes and system-level specifications such as the supply voltage range (870 mV–930 mV), surface-mount package, and –40 °C to 100 °C operating range make this device suitable for demanding embedded and industrial applications that require large logic capacity and broad I/O connectivity.
Key Features
- Core Logic 622,000 logic elements for complex logic and custom hardware designs.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support large state machines, buffering, and data storage.
- I/O Capacity 840 I/Os to enable extensive peripheral, mezzanine, and board-level interfacing without external multiplexing.
- Package & Mounting 1932-BBGA (FCBGA) package; supplier device package noted as 1932-FBGA, FC (45×45). Surface-mount mounting style for standard PCB assembly.
- Power Supply Core supply voltage range specified at 870 mV to 930 mV to define power and voltage planning for system designs.
- Temperature Grade Industrial operating temperature range of –40 °C to 100 °C for deployment in temperature-challenging environments.
- Regulatory RoHS compliant.
Typical Applications
- High-density digital designs Leverage 622,000 logic elements and ~51.2 Mbits of embedded memory for complex state machines, protocol processing, and custom accelerators.
- High I/O systems Use the 840 I/Os to connect multiple peripherals, mezzanine modules, or broad board-level interfaces without extensive external logic.
- Industrial deployments The –40 °C to 100 °C rating supports designs intended for industrial temperature environments.
Unique Advantages
- Large programmable fabric: The substantial logic element count enables consolidation of multi-function designs into a single device.
- Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and scratch storage.
- Extensive I/O availability: 840 I/Os provide flexibility for dense connectivity and system integration without extra interface chips.
- Industrial temperature capability: Rated from –40 °C to 100 °C for reliable operation in temperature-critical installations.
- Board-level integration: 1932-BBGA (FCBGA) packaging and surface-mount mounting support modern PCB assembly processes for compact system designs.
Why Choose 5SGXMA7N2F45I2WN?
This Stratix V GX FPGA combines a large logic element count, substantial embedded memory, and a very high I/O count in a single industrial-grade package, enabling consolidation of complex system functions and flexible board-level integration. The defined supply voltage window and broad operating temperature range make the device practical for robust embedded and industrial applications where on-chip capacity and connectivity reduce BOM complexity.
For designs that require scalability in logic and memory resources while maintaining broad peripheral connectivity and industrial temperature performance, the 5SGXMA7N2F45I2WN delivers a verifiable specification set to support long-term development and deployment.
Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA7N2F45I2WN.

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