5SGXMA7N2F45I3LN

The 5SGXMA7N2F45I3LN is an Intel Stratix V GX family FPGA in a 1932-ball FCBGA package, offering very large logic capacity and high I/O density for industrial-grade systems. It combines 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 840 I/O to support complex, high-density digital designs.

Designed for surface-mount assembly and rated for industrial temperature operation, this device is suited to applications that require large programmable logic resources, extensive I/O, and a robust thermal/voltage operating window.

Key Features

• High Logic Capacity — 622,000 logic elements to implement large-scale custom logic, datapaths, and control architectures.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, look-up tables, and state storage within the FPGA fabric.
• High I/O Count — 840 I/O pins to support dense board-level routing and numerous peripheral interfaces.
• Package & Mounting — 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC, 45×45 mm) optimized for surface-mount assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Core Supply Range — Core voltage supply specified from 820 mV to 880 mV for predictable power planning.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Large logic capacity and on-chip memory enable implementation of complex algorithms, packet processing, and custom compute pipelines.
• High I/O systems — The 840 I/O count supports dense peripheral connectivity, multi-channel interfaces, and board-level signal routing.
• Industrial control and automation — Industrial temperature rating and robust package make the device suitable for industrial instrumentation and control systems.
• High-speed serial/transceiver-based designs — Part of the Stratix V GX family (series datasheet information) for applications requiring advanced transceiver capabilities within the family scope.

Unique Advantages

• Large programmable fabric: 622,000 logic elements provide headroom for complex state machines, wide datapaths, and parallel processing blocks, reducing the need for multiple devices.
• Substantial embedded memory: Approximately 51.2 Mbits of RAM on-chip reduces external memory dependence and improves data throughput for buffering and caching tasks.
• Extensive I/O capacity: 840 I/O pins simplify integration of multiple interfaces and sensors without external multiplexing, lowering BOM complexity.
• Industrial-ready thermal range: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact, production-ready package: 1932-ball FCBGA (45×45 mm supplier package) in a surface-mount format streamlines manufacturing for high-density boards.
• Standards-compliant supply and materials: RoHS compliance and defined core supply range aid in predictable power design and regulatory alignment.

Why Choose 5SGXMA7N2F45I3LN?

The 5SGXMA7N2F45I3LN offers a balance of very large logic capacity, significant on-chip memory, and high I/O count in an industrial-temperature, surface-mount FCBGA package. It is targeted at engineers building complex, high-density FPGA designs that require substantial programmable resources and robust environmental performance.

Its clear electrical and mechanical parameters—622,000 logic elements, approximately 51.2 Mbits of embedded RAM, 840 I/O, a defined core voltage range, and RoHS compliance—make it straightforward to evaluate for system integration, thermal planning, and long-term deployment in industrial applications.

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