5SGXMA7N3F40C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 915 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N3F40C2G – Stratix® V GX FPGA, 622,000 logic elements, approximately 51.2 Mbits RAM, 600 I/Os, 1517‑BBGA
The 5SGXMA7N3F40C2G is a Stratix® V GX field programmable gate array (FPGA) in a 1517‑BBGA FCBGA package, provided as a commercial‑grade surface‑mount device. It delivers high logic density and substantial on‑chip memory together with a large I/O count, targeting designs that require complex programmable logic, extensive interfacing, and scalable embedded memory.
As a Stratix V GX device, this family is characterized in the datasheet for high‑performance core and transceiver capabilities. This specific device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 600 user I/Os, making it suitable for systems requiring dense logic integration and broad external connectivity within a commercial temperature range.
Key Features
- Core Logic 622,000 logic elements (logic element cells) for implementing large, complex programmable logic designs.
- Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for data buffering, LUTs, and state storage without relying on external memory.
- I/O Density 600 user I/Os to support broad peripheral interfacing and multi‑channel connectivity.
- Package & Mounting 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40); surface‑mount mounting type for modern PCB assembly.
- Power Supply Core voltage supply specified between 870 mV and 930 mV to match system power planning and regulator selection.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications and environments.
- Standards Compliance RoHS compliant to meet common environmental requirements for assembly and distribution.
- Stratix V GX Family Characteristics Part of the Stratix V GX family; the family datasheet documents transceiver, core, and I/O switching characteristics and offers multiple transceiver speed grades across the Stratix V lineup.
Typical Applications
- High‑density programmable logic systems Implement complex custom logic and state machines using the device’s 622,000 logic elements and substantial embedded RAM.
- Multi‑channel I/O and protocol bridging Leverage 600 I/Os to aggregate, convert, or bridge numerous parallel and serial interfaces on a single programmable device.
- Data buffering and on‑chip storage Use approximately 51.2 Mbits of embedded memory for packet buffering, line‑rate FIFOs, and intermediate data storage without immediate external memory.
- High‑performance system integration Integrate large functional blocks and peripherals into a single FPGA package to consolidate system designs in commercial applications.
Unique Advantages
- High logic capacity: 622,000 logic elements enable large, consolidated FPGA designs that reduce the need for multiple devices.
- Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM provides internal storage for buffering and state retention, minimizing external memory dependencies.
- Extensive I/O footprint: 600 user I/Os accommodate broad peripheral connectivity and multi‑lane interfaces on a single package.
- Compact, surface‑mount package: 1517‑BBGA (40×40) FCBGA supports dense PCB layouts while maintaining high integration density.
- Commercial temperature rating: Qualified for 0 °C to 85 °C operation to meet typical commercial deployment environments.
- Environmental compliance: RoHS compliant for regulatory and supply‑chain compatibility.
Why Choose 5SGXMA7N3F40C2G?
The 5SGXMA7N3F40C2G combines substantial logic resources, large embedded memory, and a high I/O count in a compact FCBGA package for commercial applications. It is a solid choice for engineers and system designers who need a single, highly capable FPGA to implement large programmable functions, consolidate interfaces, and handle significant on‑chip data storage.
Backed by the Stratix V family characterization in the device datasheet, this GX‑class device aligns with designs that require rigorous core and I/O planning, and it fits into development flows that leverage the Stratix V device documentation for electrical and switching characteristics.
Request a quote or submit a sales inquiry to get pricing, availability, and lead‑time information for part number 5SGXMA7N3F40C2G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018