5SGXMA7N2F45I3WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,471 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N2F45I3WN – Stratix® V GX FPGA, 622,000 logic elements, 840 I/O, 1932-BBGA
The 5SGXMA7N2F45I3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA FCBGA package, offered in an industrial temperature grade. It provides a high-capacity programmable fabric with 622,000 logic elements and substantial on-chip memory, designed for designs that demand large logic resources and high I/O counts.
With 840 user I/O pins, a low-voltage core supply range (820 mV to 880 mV), and rated operation from –40 °C to 100 °C, this device targets systems that require dense integration, broad I/O connectivity, and industrial temperature operation.
Key Features
- Programmable Capacity — 622,000 logic elements to implement large, complex digital designs and custom hardware accelerators.
- Embedded Memory — Approximately 51.2 Mbits of embedded memory for buffering, on-chip data storage, and state memory.
- High I/O Count — 840 user I/O pins to support complex peripheral interfaces and high channel counts.
- Transceiver Capabilities (Stratix V GX family) — Stratix V GX devices support GX transceiver channel speed grades up to 14.1 Gbps across available speed grades, enabling high-speed serial connectivity where required by the design.
- Power and Voltage — Core voltage supply range specified from 820 mV to 880 mV for core power planning and regulation design.
- Package & Mounting — 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45) with surface-mount mounting for high-density board integration.
- Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for use in industrial temperature environments.
- RoHS Compliant — Device is RoHS compliant to meet common environmental and regulatory requirements.
Typical Applications
- High-density logic systems — Implement large-scale digital logic and custom accelerators using the device’s 622,000 logic elements and extensive embedded memory.
- Systems requiring broad I/O — Use the 840 user I/O pins to connect numerous peripherals, parallel interfaces, or multi-channel front ends.
- Industrial equipment — Industrial temperature rating (–40 °C to 100 °C) and RoHS compliance make the device suitable for industrial control and automation systems that need robust operation over wide temperature ranges.
- High-speed serial interfaces — As a Stratix V GX family device, leverage supported GX transceiver speed grades for designs that require high-speed serial links.
Unique Advantages
- Large programmable fabric: 622,000 logic elements provide capacity for complex SoC-style implementations and large parallel processing pipelines.
- Substantial on-chip memory: Approximately 51.2 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
- Extensive I/O connectivity: 840 I/O pins enable flexible partitioning of interfaces and high channel density without external multiplexing.
- Industrial-ready thermal range: Specified operation from –40 °C to 100 °C supports deployments in challenging temperature environments.
- Compact, high-density package: 1932-BBGA / 1932-FBGA (45×45) packaging supports high integration on modern PCBs with surface-mount assembly.
- Regulatory friendliness: RoHS compliance simplifies environmental conformity planning.
Why Choose 5SGXMA7N2F45I3WN?
The 5SGXMA7N2F45I3WN positions itself as a high-capacity Stratix V GX FPGA suited for engineers and system designers who need large logic resources, considerable embedded memory, and extensive I/O in an industrial-temperature-rated device. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/O provides the building blocks for complex, high-channel-count designs.
This device is appropriate for designs that prioritize integration density, broad peripheral connectivity, and operation across wide temperatures. The standardized package and surface-mount mounting support modern assembly workflows, while RoHS compliance assists with environmental requirements.
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