5SGXMA7N2F45I3G

The 5SGXMA7N2F45I3G is an Intel Stratix V GX family field programmable gate array (FPGA) in a 1932-BBGA FCBGA package. It delivers large on-chip logic and memory capacity with a wide I/O complement and is offered in an industrial temperature grade.

Designed for systems that require substantial programmable logic, abundant I/O, and significant embedded memory, this device targets high-density embedded and industrial designs where performance, integration, and robustness across temperature extremes are important.

Key Features

• Logic Capacity — 622,000 logic elements to implement complex digital functions and large-scale custom logic.
• Embedded Memory — Approximately 51 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Count — 840 I/O pins for extensive peripheral, board-level, and fabric interfacing.
• Package & Mounting — 1932-BBGA (FCBGA) in a 1932-FBGA, FC (45×45) footprint; surface-mount device for modern PCB assembly.
• Power Supply — Core voltage supply range from 820 mV to 880 mV for defined core power provisioning.
• Temperature Grade — Industrial operation from −40 °C to 100 °C for deployments in challenging thermal environments.
• RoHS Compliance — Meets RoHS environmental requirements.

Typical Applications

• High-density embedded systems — Use the large logic element count and embedded RAM to implement complex system-on-chip functions and custom accelerators.
• Industrial control and automation — Industrial-grade temperature range and extensive I/O make it suitable for control logic, sensor aggregation, and real-time processing in industrial environments.
• Data processing and buffer management — Significant on-chip memory supports buffering and local data manipulation for throughput-sensitive designs.

Unique Advantages

• Substantial programmable logic: 622,000 logic elements enable large, integrated digital designs and consolidation of multiple functions into a single FPGA.
• Generous embedded memory: Approximately 51 Mbits of on-chip RAM reduces dependency on external memory and simplifies board-level design.
• Extensive I/O availability: 840 I/Os allow flexible interfacing with peripherals, mezzanine modules, and high-pin-count board topologies.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• High-density package: 1932-BBGA FCBGA package provides a compact, surface-mount solution for space-constrained, high-pin-count applications.
• Defined core power window: 820–880 mV supply specification simplifies power delivery design and regulation planning.

Why Choose 5SGXMA7N2F45I3G?

This Stratix V GX device balances high logic capacity, significant embedded memory, and a large I/O complement in a single industrial-grade package—making it well suited for engineers consolidating multiple functions or implementing complex processing pipelines on one FPGA. The combination of on-chip resources and a high-density package supports compact board designs and robust operation across a wide temperature range.

Backed by Intel Stratix V family documentation and specifications, the 5SGXMA7N2F45I3G is a practical choice for teams building high-density embedded systems, industrial controllers, and data-processing hardware that require proven, scalable FPGA resources.

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