5SGXMA7N2F45I2LN

The 5SGXMA7N2F45I2LN is a Stratix® V GX family FPGA from Intel, offering very large programmable logic capacity and substantial on-chip memory for demanding designs. It is a surface-mount, industrial-grade device supplied in a 1932-BBGA FCBGA package and is designed for applications that require high logic density, abundant I/O, and robust operating-range support.

Key Features

• Core Logic Capacity — 622,000 logic elements for large-scale, highly parallel logic implementations.
• Embedded Memory — Total on-chip RAM of 51,200,000 bits (approximately 51.2 Mbits) to support data buffering, FIFOs, and local storage.
• I/O Resources — 840 user I/Os to interface with high-pin-count peripherals, memory buses, and multi-channel front-ends.
• Power and Supply — Core voltage supply range of 820 mV to 880 mV, enabling defined core operating conditions.
• Thermal and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Package and Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
• Standards Compliance — RoHS compliant, meeting common environmental restriction requirements.

Typical Applications

• High-density programmable logic systems — Implement large custom datapaths, state machines, and parallel processing pipelines using the device’s extensive logic and memory resources.
• I/O-intensive designs — Systems that require many external interfaces or multi-channel front-ends benefit from the 840 available I/Os.
• Industrial embedded systems — Industrial-grade temperature range and robust packaging make the device suitable for industrial embedded applications that require extended operating range.

Unique Advantages

• Large programmable fabric — 622,000 logic elements let designers implement complex, multi-functional designs on a single device, reducing board-level integration needs.
• Substantial on-chip memory — Approximately 51.2 Mbits of embedded RAM reduce dependence on external memory for buffering and temporary storage, simplifying BOM and timing constraints.
• High pin-count I/O — 840 I/Os provide flexibility for multiple interfaces, parallel buses, and dense peripheral connectivity.
• Industrial operating range — Rated from −40 °C to 100 °C to support deployment in environments requiring extended temperature tolerance.
• Compact, surface-mount packaging — 1932-BBGA FCBGA package with 45×45 supplier footprint enables dense PCB implementations while supporting strong thermal and mechanical characteristics.
• Regulatory readiness — RoHS compliance aligns the device with environmental restriction requirements for many global markets.

Why Choose 5SGXMA7N2F45I2LN?

The 5SGXMA7N2F45I2LN positions itself as a high-capacity Stratix V GX FPGA option for engineers who need significant logic resources, extensive on-chip memory, and a large I/O complement in an industrial-grade package. Its clearly defined supply-voltage range and wide operating temperature window make it suitable for designs that require predictable electrical and thermal behavior over time.

This device is appropriate for teams designing scalable, long-life systems where integration density, deterministic on-chip memory, and numerous external interfaces reduce system complexity and bill-of-materials cost while leveraging Intel’s Stratix V GX device family characteristics.

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