5SGXMA7N2F45C3N

The 5SGXMA7N2F45C3N is a Stratix V GX field programmable gate array from Intel, offering very high logic density and large on-chip memory capacity in a high-pin-count FCBGA package. Designed for commercial-grade designs, this device provides 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 user I/Os to support complex digital and system-level integration.

Its package and electrical characteristics—including a 1932-BBGA FCBGA package (1932-FBGA, FC 45×45) and a core voltage supply range of 820 mV to 880 mV—make it suitable for systems that require high integration density, significant on-chip memory bandwidth, and extensive I/O connectivity within a commercial temperature envelope (0 °C to 85 °C).

Key Features

• Core Logic  622,000 logic elements for implementing large-scale FPGA designs and complex processing pipelines.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support deep buffering, frame/packet storage, and memory-intensive logic functions.
• I/O Capacity  840 user I/Os enabling wide external connectivity and high pin-count system integration.
• Package and Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45) with surface-mount mounting for compact, board-level deployment.
• Power/Core Supply  Core voltage supply specified from 820 mV to 880 mV allowing precise core power provisioning for the Stratix V GX family.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Meets RoHS requirements for lead-free assembly compatibility.

Typical Applications

• High-density digital processing  Implement large custom logic blocks and data-paths using 622,000 logic elements and extensive on-chip RAM for buffering and state storage.
• Systems requiring extensive I/O  Devices with up to 840 I/Os are suitable for designs that need broad sensor, memory, or peripheral interfacing at the board level.
• Embedded memory–intensive functions  Use approximately 51.2 Mbits of embedded memory for packet buffering, frame storage, or intermediate data staging without relying on external RAM.

Unique Advantages

• High logic and memory integration: Combines 622,000 logic elements with ~51.2 Mbits of RAM to reduce dependence on external logic and memory components.
• Large I/O count: 840 user I/Os enable dense connectivity and simplify board-level routing for complex systems.
• High‑pin-count FCBGA package: The 1932-BBGA (1932-FBGA, FC 45×45) package supports high routing density and system integration in a compact footprint.
• Controlled core supply range: Defined core voltage of 820–880 mV enables predictable power design and core voltage management for the Stratix V GX device family.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for reliable performance in commercial environments.
• RoHS compliance: Conforms to RoHS for lead-free manufacturing processes.

Why Choose 5SGXMA7N2F45C3N?

The 5SGXMA7N2F45C3N is positioned for commercial designs that need a very high-density FPGA with substantial embedded memory and extensive I/O. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os enables consolidation of complex digital functions and buffering on a single device, reducing board-level component count and simplifying system architecture.

Backed by Intel’s Stratix V GX device family and provided in a 1932-BBGA FCBGA package, this device offers a balance of integration, predictable electrical characteristics (820–880 mV core supply), and commercial-grade operating range—making it suitable for customers designing high-capacity, high-connectivity FPGA-based systems.

Request a quote or submit an inquiry to purchase the 5SGXMA7N2F45C3N and evaluate how its logic density, embedded memory, and I/O capacity can simplify and accelerate your next FPGA design.