5SGXMA7N2F45I3LG

The 5SGXMA7N2F45I3LG is an industrial-grade Stratix V GX FPGA supplied in a 1932-BBGA FCBGA package intended for surface-mount applications. It integrates 622,000 logic elements and approximately 51.2 Mbits of embedded memory, delivering a high-density programmable fabric with up to 840 I/O pins.

Targeted for demanding embedded and communications applications, this device combines large on-chip memory, extensive I/O, and a wide operating temperature range to support complex logic, buffering and high-pin-count system designs.

Key Features

• Logic Capacity  622,000 logic elements for implementing large-scale digital functions and complex system logic.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, FIFOs, and on-chip storage without external memory.
• I/O Density  840 user I/O pins to connect to high-pin-count peripherals, parallel buses, and multi-channel interfaces.
• Package & Mounting  1932-BBGA (FCBGA) supplier device package 1932-FBGA, FC (45×45); surface-mount mounting for compact board integration.
• Power  Core voltage supply range 820 mV to 880 mV to match system power-rail requirements.
• Industrial Operating Range  Rated for industrial operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant for environmental and regulatory conformance.

Typical Applications

• Network & Communications  Use the large logic fabric and high I/O count to implement packet processing, protocol bridging, and interface aggregation.
• High-Density Embedded Systems  Implement custom SoC logic, hardware accelerators, and glue logic where substantial on-chip memory and logic are required.
• Industrial Control  Deploy in control and automation systems that require wide temperature tolerance, many I/O, and substantial programmable logic.
• Data Buffering & Aggregation  Leverage the embedded RAM and I/O count for buffering, packet queuing, and multi-channel data aggregation functions.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O count: 840 I/O pins support wide parallel interfaces and multi-channel connectivity without external demultiplexing.
• Industrial-grade temperature range: Operation from −40 °C to 100 °C supports deployment in temperature-demanding applications.
• Compact surface-mount BBGA package: 1932-BBGA, FCBGA (45×45) provides a high-density footprint for space-constrained PCBs.
• Regulatory readiness: RoHS compliance simplifies integration into products with environmental requirements.

Why Choose 5SGXMA7N2F45I3LG?

The 5SGXMA7N2F45I3LG positions itself as a high-density, industrial-grade Stratix V GX FPGA targeted at designs that require large programmable logic, significant on-chip memory, and a high pin count in a compact surface-mount package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/O makes it suitable for systems that need to consolidate multiple subsystems or implement complex hardware acceleration.

Choose this device when your design requires scalability, robust temperature performance, and a dense package solution that supports extensive I/O and memory on-chip, helping to reduce BOM complexity and streamline board-level integration.

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