5SGXMA7N2F45I3N

The 5SGXMA7N2F45I3N is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high‑density programmable logic applications. As a Stratix V GX device, it delivers a large logic fabric and extensive I/O to support complex system designs that require significant on‑chip resources.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 user I/Os, this device targets designs that demand high integration, significant local memory, and broad external connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity  622,000 logic elements provide substantial programmable fabric for complex custom logic, signal processing, and acceleration functions.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Density  840 user I/Os support extensive peripheral, bus, and high‑pin‑count interfacing needs.
• Power/Core Voltage  Core supply range of 820 mV to 880 mV to match system power rails and core requirements.
• Package & Mounting  1932‑BBGA, FCBGA package (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor for high‑density PCB integration.
• Temperature & Grade  Industrial grade device rated for operation from –40 °C to 100 °C for temperature‑sensitive deployments.
• RoHS Compliant  Meets RoHS standards for material and manufacturing compliance.

Typical Applications

• High‑density programmable logic designs  Large logic capacity supports complex state machines, protocol handling, and custom accelerators.
• Systems requiring significant on‑chip memory  Approximately 51.2 Mbits of embedded RAM for buffering, packet queues, and local data storage.
• High‑I/O connectivity platforms  840 I/Os enable dense peripheral interfacing, multi‑lane connectivity, and complex board‑level integrations.
• Industrial temperature applications  Rated –40 °C to 100 °C for deployments where extended ambient ranges are required.

Unique Advantages

• High integration density: 622,000 logic elements and substantial embedded RAM reduce the need for external logic and memory, simplifying system BOM.
• Extensive I/O capability: 840 user I/Os provide flexibility for connecting numerous peripherals, interfaces, and custom I/O standards.
• Industrial temperature resilience: Operation from –40 °C to 100 °C supports designs deployed in demanding thermal environments.
• Compact system footprint: 1932‑BBGA FCBGA surface‑mount package enables high‑density PCB layouts while preserving performance.
• Standards‑aware manufacturing: RoHS compliance aligns with common environmental and supply‑chain requirements.
• Defined core voltage window: 820 mV–880 mV core supply range provides clear power design parameters for system architects.

Why Choose 5SGXMA7N2F45I3N?

The 5SGXMA7N2F45I3N positions itself as a high‑capacity Stratix V GX FPGA option for designers who need a large programmable fabric, significant embedded memory, and a high I/O count within an industrial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on‑chip RAM, and 840 I/Os supports demanding embedded, communications, and compute‑oriented designs that require integration and configurability.

Manufactured in a 1932‑BBGA FCBGA surface‑mount package and backed by Intel as the manufacturer, this device is suited to teams building scalable, robust hardware platforms where long‑term availability and clear electrical parameters (including an 820 mV–880 mV core supply range) are important to system design and power planning.

Request a quote or submit an inquiry to get pricing and availability for the 5SGXMA7N2F45I3N and to discuss how it can fit your next high‑density FPGA design.