5SGXMA7N3F40C2

The 5SGXMA7N3F40C2 is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a large programmable fabric with 622,000 logic elements and substantial embedded memory to support complex, high-density logic implementations.

Packaged in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package with 600 user I/Os and a core voltage range of 870 mV to 930 mV, this commercial-grade device targets designs that require significant on-chip resources, high I/O counts, and platform-level integration.

Key Features

• High-density core — 622,000 logic elements for large, complex designs and extensive custom logic implementation.
• On-chip memory — Approximately 51.2 Mbits of embedded memory for buffering, packet storage, and memory-intensive algorithms.
• Rich I/O — 600 I/O pins to support dense connectivity and multiple parallel interfaces.
• Power and voltage — Core supply range from 870 mV to 930 mV to match system power-rail planning and sequencing requirements.
• Package and mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package; surface-mount for modern PCB assembly processes.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Family transceiver options — As a Stratix V GX device, the family offers GX transceiver speed grade options defined in the device datasheet.
• RoHS compliant — Conforms to RoHS requirements for environmental and manufacturing compliance.

Typical Applications

• Communications and networking — Large logic capacity and family transceiver options support protocol processing, packet handling, and interface bridging.
• Data processing and acceleration — Significant on-chip memory and logic element count enable hardware acceleration and custom datapaths.
• System integration and prototyping — High I/O density and flexible programmable fabric allow consolidation of multiple functions and board-level prototyping.

Unique Advantages

• Large programmable fabric: 622,000 logic elements provide the capacity to implement complex algorithms and large-scale HDL designs without external logic.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O connectivity: 600 I/Os enable dense peripheral integration and multiple parallel interfaces on a single device.
• Standard commercial grade: 0 °C to 85 °C operating range aligns with typical embedded and communications equipment requirements.
• Compact package: 1517-BBGA FCBGA in a 40×40 footprint supports high-pin-count designs in a manufacturable surface-mount form factor.
• Compliance-ready: RoHS status provides environmental compliance for modern manufacturing flows.

Why Choose 5SGXMA7N3F40C2?

The 5SGXMA7N3F40C2 positions itself as a high-capacity, commercial-grade FPGA for designs that require a large programmable fabric, extensive on-chip memory, and broad I/O connectivity. Its core voltage range and surface-mount 1517-BBGA package support integration into contemporary power and PCB architectures.

Engineers and system designers who need significant on-chip resources, dense I/O, and the access to Stratix V GX family electrical specifications will find this device suitable for complex communications, data-processing, and system-integration applications where a high logic element count and embedded memory are central to the design.

Request a quote today to check pricing and availability for 5SGXMA7N3F40C2 and begin planning procurement for your design.