5SGXMA7N3F40C2WN

The 5SGXMA7N3F40C2WN is a commercial-grade Stratix® V GX field programmable gate array (FPGA) from Intel. It delivers large programmable logic capacity and on-chip memory in a surface-mount FCBGA package tailored for high-density system designs.

With approximately 622,000 logic elements, roughly 51.2 Mbits of embedded memory and 600 user I/O pins, this device is suited to designs that require substantial logic resources, high I/O density and compact packaging while operating across a commercial temperature range.

Key Features

• Core Logic  Approximately 622,000 logic elements to implement complex programmable logic and large-scale custom logic functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, large lookup tables, and local storage without external memory.
• I/O Density  600 user I/O pins to support dense peripheral, parallel and multi-channel interfaces.
• Power  Core voltage supply range of 870 mV to 930 mV for compatibility with specified core power domains.
• Package & Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting standard environmental material restrictions.

Typical Applications

• High-density digital systems  Designs that need large programmable logic capacity and substantial on-chip RAM for local data processing.
• Multi‑interface controllers  Systems requiring a high number of I/O signals—up to 600 pins—to interface with multiple peripherals or parallel buses.
• Compact, board-level integration  Applications that benefit from a high‑capacity FPGA in a surface-mount FCBGA package for space-constrained PCBs.

Unique Advantages

• Substantial logic capacity: The large count of logic elements enables complex designs and high gate-equivalent implementations without immediate migration to multi-FPGA solutions.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks, simplifying BOM and layout.
• High I/O availability: 600 I/O pins provide flexibility when connecting numerous peripherals, sensors, or parallel interfaces.
• Compact package: The 1517-BBGA FCBGA 40×40 supplier package supports dense board layouts while maintaining high pin count.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for mainstream electronics and embedded applications.
• Regulatory compliance: RoHS compliance supports environmental requirements for many product lines.

Why Choose 5SGXMA7N3F40C2WN?

This Stratix V GX FPGA combines very large programmable logic capacity, substantial embedded RAM and a high I/O count in a compact surface-mount FCBGA package, positioning it for demanding, board‑level designs where integration density and on‑chip resources matter. Its commercial temperature grade and RoHS compliance make it suited to a wide range of mainstream electronic products.

Design teams targeting systems that require scaleable logic, abundant on-chip memory and extensive I/O can leverage this device’s resource mix to reduce external component count and simplify system architecture while keeping to commercial operating conditions.

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