5SGXMA7N3F40C3N

The Intel Stratix® V GX 5SGXMA7N3F40C3N is a high-density FPGA offered in a 1517-ball FBGA package for surface-mount applications. It integrates a large fabric of logic, substantial on‑chip memory, and extensive I/O resources to address complex digital signal processing, protocol, and system‑level integration tasks.

This commercial‑grade device is supplied with an 820 mV to 880 mV core voltage range, operates from 0 °C to 85 °C, and is RoHS compliant. The device datasheet for the Stratix V family documents electrical and switching characteristics, I/O timing, and transceiver capability information relevant to Stratix V GX devices.

Key Features

• High logic density – Approximately 622,000 logic elements to implement large, complex logic designs and parallel processing functions.
• Embedded memory – Approximately 51.2 Mbits of on‑chip RAM for buffering, FIFOs, and data‑intensive algorithms.
• Extensive I/O – 600 user I/O pins to support wide parallel interfaces, multiple serial lanes, and diverse system connections.
• Package and mounting – 1517‑FBGA (40×40) package case (1517‑BBGA, FCBGA) optimized for surface‑mount assembly.
• Power – Core supply voltage range 820 mV to 880 mV, enabling defined power budgeting and power‑supply design.
• Commercial grade operation – Rated for 0 °C to 85 °C operating temperature for standard commercial applications.
• Standards and compliance – RoHS compliant, supporting regulatory and assembly requirements.
• Documented electrical characteristics – Stratix V device datasheet covers operating conditions, switching characteristics, I/O timing, and transceiver details applicable to Stratix V GX devices.

Typical Applications

• High‑density signal processing – Implement DSP pipelines, parallel processing blocks, and custom accelerators using abundant logic and on‑chip RAM.
• Protocol aggregation and bridging – Use large I/O count and programmable fabric to consolidate multiple interfaces and perform protocol translation or aggregation.
• Networking and packet processing – Leverage embedded memory for packet buffering and stateful processing in network‑oriented systems.

Unique Advantages

• Large programmable fabric: Approximately 622,000 logic elements provide capacity for complex, high‑gate‑count designs, reducing the need for multiple devices.
• Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM supports deep buffering and data‑centric algorithms without external memory dependency.
• High I/O availability: 600 I/O pins enable wide parallel interfaces and multiple serial lanes to interface with peripherals and system buses.
• Compact BGA packaging: 1517‑FBGA (40×40) package delivers high pin density in a surface‑mount form factor suitable for space‑constrained PCB layouts.
• Commercial operating range: Rated for 0 °C to 85 °C to meet standard commercial deployment environments.
• RoHS compliant: Supports lead‑free assembly and regulatory compliance for modern manufacturing processes.

Why Choose 5SGXMA7N3F40C3N?

The 5SGXMA7N3F40C3N delivers a combination of high logic capacity, significant embedded memory, and a large I/O complement in a compact 1517‑FBGA package. Its documented electrical and switching characteristics for the Stratix V GX family help engineers design with confidence around core supply, I/O timing, and transceiver considerations.

This device is well suited for teams building complex digital systems that require integrated memory, extensive I/O, and a single‑device approach to reduce board space and component count while maintaining clear electrical specifications and RoHS compliance.

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