5SGXMA7N3F40C3WN

The 5SGXMA7N3F40C3WN is an Intel Stratix® V GX field programmable gate array (FPGA) offered in a 1517-ball FCBGA package. It delivers a large logic fabric and on-chip memory capacity combined with extensive I/O to support demanding, integration-heavy designs.

This commercial-grade Stratix V GX device is targeted at applications that require high logic density, substantial embedded RAM, and a high I/O count within a surface-mount FCBGA package.

Key Features

• Logic Capacity — 622,000 logic elements to implement complex digital designs and dense RTL.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffers, FIFOs, and memory-intensive functions.
• I/O Density — 600 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Package & Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting for compact board integration.
• Power — Core voltage supply range of 820 mV to 880 mV to match platform power rails and optimize core performance.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS-compliant device for environmentally conscious designs.
• Stratix V GX Family Characteristics — As a Stratix V GX device, the family provides defined transceiver speed grades for high-speed serial I/O at the series level (refer to device documentation for specific grade details).

Typical Applications

• High-density digital processing — Implement compute- and control-intensive logic that requires large numbers of logic elements and embedded RAM.
• High-channel I/O systems — Drive wide parallel interfaces and multiple peripherals using the device’s 600 I/O pins.
• High-performance communications (series-level) — Leverage Stratix V GX family transceiver speed grade options for designs that need high-speed serial connectivity (see device documentation for supported grades).

Unique Advantages

• Large logic fabric: 622,000 logic elements enable implementation of complex, feature-rich designs in a single FPGA.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and simplifies board routing.
• Extensive I/O support: 600 I/Os provide flexibility for wide buses, multi-channel interfaces, and dense peripheral connectivity.
• Compact FCBGA packaging: 1517-ball FCBGA allows high density routing on compact PCBs while supporting surface-mount assembly.
• Low-voltage core operation: 820 mV–880 mV supply range supports modern, low-voltage system architectures.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation and RoHS-compliant construction for mainstream electronics.

Why Choose 5SGXMA7N3F40C3WN?

The 5SGXMA7N3F40C3WN combines a high logic element count, sizable embedded memory, and a large I/O complement in a compact FCBGA package, making it a suitable option for engineers building integration-dense, performance-oriented systems. As a member of the Stratix V GX family, it aligns with series-level transceiver options and documented electrical characteristics to address designs that demand both logic capacity and I/O bandwidth.

Choose this device when you need a commercially rated Stratix V GX FPGA that balances dense logic resources, on-chip memory, and extensive I/O for scalable, board-level integration in surface-mount form factors.

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