5SGXMA7N3F40C4WN

The 5SGXMA7N3F40C4WN is a Stratix V GX field-programmable gate array (FPGA) device. It delivers very high logic capacity and substantial on-chip embedded memory in a BGA FCBGA package for surface-mount board designs. This device is intended for designs that require large logic density, significant embedded RAM, and extensive I/O connectivity while operating within commercial temperature limits.

Key Features

• Logic Capacity  Provides 622,000 logic elements suitable for complex digital designs and high-density integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions.
• High I/O Count  600 user I/Os to accommodate wide parallel interfaces and extensive external connectivity.
• Core Voltage  Operates from a core supply of 820 mV to 880 mV, supporting low-voltage core designs.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier package listed as 1517-FBGA (40×40); surface-mount device for PCB assembly.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.
• Stratix V GX Family Capabilities  As part of the Stratix V GX series, the family documentation describes available GX transceiver speed grades and core speed grades for high-speed serial implementations (series-level information).

Typical Applications

• High-density digital systems  Use the device where large logic capacity and embedded RAM are required to implement complex custom logic and datapaths.
• High-speed serial systems  Leverage the Stratix V GX family’s transceiver-grade capabilities (series-level) for designs that require high-throughput serial links.
• Complex I/O interfacing  Deploy in applications that need many parallel and serial interfaces, benefiting from the 600 available I/Os.
• Memory-intensive algorithms  Implement buffering, packet processing, or local data storage using the device’s approximately 51.2 Mbits of embedded RAM.

Unique Advantages

• High logic density: 622,000 logic elements enable integration of large, complex functions into a single FPGA device, reducing board-level component count.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory supports large internal datasets and reduces dependence on external memory.
• Extensive I/O capability: 600 I/Os provide flexibility to connect multiple peripherals, wide buses, and multiple high-speed interfaces without external multiplexing.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV supports power-optimized core designs when paired with appropriate power delivery.
• BGA surface-mount packaging: 1517-BBGA (FCBGA) in a 1517-FBGA (40×40) supplier package balances footprint and thermal/ electrical performance for high-density boards.
• Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose 5SGXMA7N3F40C4WN?

The 5SGXMA7N3F40C4WN positions itself as a high-capacity Stratix V GX FPGA option for designers who need a single-device solution with hundreds of thousands of logic elements, large embedded RAM, and broad I/O. Its commercial-grade rating, RoHS compliance, and surface-mount BGA package make it suitable for production systems that demand integration and reliability within the specified operating range.

This device is appropriate for teams building complex, memory- and I/O-intensive hardware functions where on-chip resources can reduce BOM complexity and simplify board-level design. Selection of this FPGA provides scalability within the Stratix V GX family and aligns with designs that benefit from series-level transceiver and speed-grade options described in the Stratix V documentation.

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