5SGXMA7N3F40I3

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 824 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N3F40I3 – Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

The 5SGXMA7N3F40I3 is an Intel Stratix V GX Field Programmable Gate Array offering high logic density and substantial on-chip memory. The device provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory with 600 user I/Os for complex, I/O‑rich designs.

Packaged in a 1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40) surface-mount package, this industrial-grade FPGA is specified for operation from −40 °C to 100 °C and a core voltage supply range of 820 mV to 880 mV. The device is RoHS compliant.

Key Features

  • Core Capacity — 622,000 logic elements to implement large-scale programmable logic and complex functions.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
  • I/O Resources — 600 user I/Os providing extensive interfacing options for high-pin-count systems.
  • Power Specification — Core voltage supply range of 820 mV to 880 mV for defined power delivery and design planning.
  • Package & Mounting — 1517-BBGA FCBGA package (supplier package 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
  • Temperature & Grade — Industrial grade device rated for −40 °C to 100 °C operation for deployments in demanding environments.
  • Environmental Compliance — RoHS compliant, supporting regulatory-driven designs.

Unique Advantages

  • High logic density: 622,000 logic elements enable implementation of complex algorithms and large custom IP blocks without immediate need for multiple FPGAs.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces external memory dependency for many buffering and data-processing tasks.
  • Extensive I/O availability: 600 I/Os provide the connectivity needed for multi‑lane interfaces, sensor arrays, or large peripheral counts.
  • Industrial-rated operation: Specified −40 °C to 100 °C temperature range and industrial grade designation enable use in temperature-challenging deployments.
  • Compact BGA footprint: 1517-BBGA FCBGA surface-mount package helps minimize PCB area while supporting high pin counts.
  • Standards-conformant supply: RoHS compliance supports environmentally regulated product development.

Why Choose 5SGXMA7N3F40I3?

The 5SGXMA7N3F40I3 positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that require a combination of large logic resources, significant on-chip memory, and abundant I/O. Its defined core voltage range and temperature rating simplify system-level planning for reliable operation in industrial environments.

Choose this device when you need a single-chip solution that balances density, memory, and I/O in a compact BGA package, backed by Intel Stratix V family documentation and specifications.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMA7N3F40I3.

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