5SGXMA7N3F40I3G

The 5SGXMA7N3F40I3G is a Stratix® V GX field programmable gate array (FPGA) in a 1517‑FBGA (40×40) package designed for high-density, industrial applications. It combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and up to 600 I/O to address complex system integration and high‑throughput designs.

Engineered for surface‑mount PCB assembly and rated for industrial temperature operation, this device is positioned for designs that require large programmable logic capacity, substantial on‑chip memory, and wide connectivity in a BGA package.

Key Features

• Logic Capacity  Provides 622,000 logic elements to implement large-scale digital designs and custom silicon functions.
• Embedded Memory  Includes a total of 51,200,000 bits of on‑chip RAM (approximately 51.2 Mbits) for buffering, state storage, and embedded data structures.
• I/O Density  Up to 600 user I/O pins to support broad peripheral connectivity and interfacing requirements.
• Package & Mounting  Packaged in a 1517‑BBGA / 1517‑FBGA (40×40) BGA for high pin count and reliable surface‑mount integration on modern PCBs.
• Power Supply  Operates from a core voltage supply range of 820 mV to 880 mV to match system power delivery architectures.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.
• Stratix V GX Series Characteristics  As a Stratix V GX family device, it is part of the series documented in the Stratix V device datasheet, which details available transceiver and speed grade options for GX devices.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded memory reduce external component count and simplify system architecture.
• Extensive I/O capability: 600 I/O pins enable broad device interfacing without needing additional bridge devices.
• Industrial qualification: −40 °C to 100 °C operating range supports deployment in temperature‑challenging environments.
• Compact, high‑pin package: 1517‑FBGA (40×40) packaging provides the pin count needed for dense designs while remaining compatible with surface‑mount manufacturing.
• Controlled core supply window: Narrow 820 mV–880 mV core voltage range aids predictable power budgeting and thermal planning.
• Regulatory alignment: RoHS compliance supports environmental and regulatory requirements for modern electronic products.

Why Choose 5SGXMA7N3F40I3G?

The 5SGXMA7N3F40I3G delivers substantial programmable logic, significant on‑chip memory, and high I/O density in a robust BGA package rated for industrial temperatures. It is suited to designs that demand consolidated logic resources and memory close to the fabric to minimize external BOM and optimize performance.

Backed by the Stratix V device documentation, this GX‑series FPGA is a fit for engineering teams seeking scalable logic capacity and integration in surface‑mount form factors while maintaining environmental compliance and predictable power characteristics.

Request a quote or submit an inquiry for part number 5SGXMA7N3F40I3G to receive pricing, lead‑time, and availability information tailored to your project needs.