5SGXMA7N3F40I3W

The 5SGXMA7N3F40I3W is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA surface-mount package. It delivers high logic density, large embedded memory, and abundant I/O in an industrial-grade device intended for demanding designs.

Designed for applications that require extensive on-chip logic, significant RAM capacity, and multi-gigabit I/O connectivity at industrial temperatures, this device balances compute density and system integration while operating from a low core-voltage range.

Key Features

• Core Density — 622,000 logic elements providing substantial programmable logic capacity for complex designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM (51,200,000 total RAM bits) to support buffering, packet memory, and dataflow acceleration without external memory in many use cases.
• I/O Count — 600 available I/O pins to support broad parallel interfacing, wide buses, and numerous external peripherals.
• High-speed Transceiver Family Capability — As a Stratix V GX device family member, the series includes multi-gigabit transceiver speed grades (family-level specification), enabling high-rate serial links where required by system architecture.
• Power and Voltage — Core voltage supply defined from 820 mV to 880 mV, suitable for low-voltage, high-performance logic operation.
• Package & Mounting — 1517-BBGA FCBGA (supplier device package 1517-FBGA, 40 × 40) in a surface-mount form factor for dense board-level integration.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C, supporting industrial environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Telecommunications & Networking — Multi-gigabit transceiver capability and large on-chip RAM enable packet processing, line cards, and high-speed link management.
• Data Center & Backplane Systems — High logic density and 600 I/O support complex protocol handling, header processing, and wide parallel data paths for switching and routing functions.
• Signal Processing & Accelerators — Significant logic resources combined with approximately 51.2 Mbits of embedded memory make the device suitable for streaming data pipelines, DSP blocks, and accelerator fabrics.
• Industrial Control & Instrumentation — Industrial temperature rating and extensive I/O allow the FPGA to be deployed in control systems, instrumentation, and hardened industrial equipment.

Unique Advantages

• Highly Integrated Logic Capacity: 622,000 logic elements reduce the need for multiple devices by consolidating complex functions into one FPGA.
• Large On-Chip Memory: Approximately 51.2 Mbits of embedded RAM supports substantial buffering and state storage without immediate reliance on external memory components.
• Extensive I/O: 600 I/O pins enable flexible connectivity for wide buses, multiple interfaces, and high-pin-count peripherals.
• Industrial Temperature Support: –40 °C to 100 °C rating provides robustness for deployment in harsh or tightly controlled thermal environments.
• Low Core Voltage Operation: 820–880 mV supply range enables power-optimized core operation where low-voltage domains are required.
• Surface-Mount BBGA Package: 1517-BBGA (40 × 40) supports compact board-level integration and high-density system designs.

Why Choose 5SGXMA7N3F40I3W?

The 5SGXMA7N3F40I3W combines high logic density, significant embedded memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA. Its specification makes it suitable for designers who need to consolidate complex digital functions, support high-throughput data paths, and operate across a wide temperature range.

Backed by Intel’s Stratix V family documentation and device-level electrical characteristics, this part is appropriate for projects requiring scalable logic capacity, extensive on-chip RAM, and broad interfacing options, delivering integration and flexibility for demanding system designs.

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