5SGXMA7N3F40I4N

The 5SGXMA7N3F40I4N is a Stratix® V GX field programmable gate array (FPGA) IC offering high-density programmable logic and substantial on-chip memory in a compact FCBGA package. Designed for industrial-temperature operation, this device delivers a combination of logic capacity, I/O density, and low-voltage core operation for complex, high-capacity programmable designs.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this Stratix V GX device is suitable for designs that require large logic integration, extensive I/O, and robust thermal range in a surface-mount ball-grid array package.

Key Features

• Logic Capacity — 622,000 logic elements provide substantial programmable logic resources for complex digital designs and high-integration system architectures.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many use cases.
• High I/O Count — 600 user I/O pins to support wide parallel interfaces, multi-channel connectivity, or extensive peripheral routing.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C for deployment in industrial environments requiring extended temperature range.
• Low-Voltage Core — Core supply range of 820 mV to 880 mV to match low-voltage system designs and power-delivery constraints.
• Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting for compact, board-level integration.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Industrial Control Systems — Large logic capacity and an industrial temperature range enable complex control algorithms and reliable operation in harsh environments.
• High-density I/O Systems — 600 I/O pins support multi-channel interfaces, sensor arrays, and extensive peripheral connectivity on a single device.
• Data and Signal Processing — Significant embedded memory and logic resources support buffering, parallel processing, and implementation of high-throughput data paths.

Unique Advantages

• High Logic Density: 622,000 logic elements reduce the need for multiple devices by integrating large designs into a single FPGA.
• Substantial On-chip Memory: Approximately 51.2 Mbits of embedded RAM helps minimize external memory dependencies and simplifies board design.
• Extensive I/O: 600 I/O pins allow flexible interfacing with peripherals, high-speed links, and parallel data buses.
• Industrial-grade Operation: −40°C to 100°C operating range supports deployment in demanding thermal environments.
• Compact FCBGA Package: 1517-BBGA/1517-FBGA (40×40) package provides a space-efficient footprint for high-density boards.
• Low-voltage Core: 820 mV to 880 mV supply window aligns with modern low-voltage power architectures.

Why Choose 5SGXMA7N3F40I4N?

The 5SGXMA7N3F40I4N combines significant programmable logic resources, large embedded memory, and a high I/O count in a compact, surface-mount FCBGA package rated for industrial temperatures. This configuration fits designs that demand integration of complex logic, robust I/O connectivity, and reliable operation across an extended temperature range.

For engineering teams seeking a high-density Stratix V GX device, this part provides a scalable, single-device platform that simplifies board-level integration while maintaining the electrical characteristics expected of industrial-grade programmable logic.

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