5SGXMA7N3F45C2LG

The 5SGXMA7N3F45C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offering a high-density programmable fabric in a 1932-BBGA (FCBGA) package. This commercial-grade device provides abundant logic resources, extensive on-chip memory, and a large I/O count for complex digital designs.

Engineered for designs that require significant logic capacity and flexible I/O routing, the device delivers approximately 51.2 Mbits of embedded memory, 622,000 logic elements, and 840 I/Os while operating within a core supply range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  622,000 logic elements provide a high-capacity programmable fabric for complex digital functions and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms without external memory dependency.
• I/O Density  840 user I/Os enable broad interfacing options for high-pin-count designs and multi-channel connectivity.
• Power Supply  Core voltage support from 820 mV to 880 mV allows precise power provisioning for the device’s core logic.
• Package  1932-BBGA (FCBGA) supplier device package noted as 1932-FBGA, FC (45×45) for high-density board integration.
• Commercial Grade & Temperature  Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant for regulatory alignment in standard commercial applications.

Typical Applications

• High-density programmable logic  Use where substantial logic fabric is required—622,000 logic elements support complex state machines, datapaths, and custom compute blocks.
• Memory-intensive processing  Approximately 51.2 Mbits of embedded RAM enables on-chip buffering, lookup tables, and data staging for algorithms that require large local memory.
• Multi-channel I/O aggregation  With 840 I/Os, the device is suited for designs needing extensive peripheral or parallel interface connectivity.
• System integration in commercial products  Commercial temperature rating and RoHS compliance make this device appropriate for industrial and enterprise equipment operating within 0 °C to 85 °C.

Unique Advantages

• High logic capacity: 622,000 logic elements reduce the need for multiple FPGAs by consolidating large designs into a single device.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory lowers external memory requirements and simplifies board design.
• Extensive I/O count: 840 I/Os provide flexibility to connect many peripherals, channels, or parallel interfaces without external multiplexing.
• Compact, high-density package: 1932-BBGA (45×45) package supports high pin-count integration in a compact footprint for space-constrained boards.
• Commercial readiness: Commercial temperature grade (0 °C to 85 °C) and RoHS compliance support deployment in a wide range of commercial systems.

Why Choose 5SGXMA7N3F45C2LG?

The 5SGXMA7N3F45C2LG positions itself as a high-density Stratix V GX FPGA option for designers who need extensive logic, embedded memory, and I/O resources in a single commercial-grade device. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os enables consolidation of complex functions and simplifies system architecture.

Backed by Intel’s Stratix V family documentation and electrical characterization, this device is suited for development teams and procurement focused on scalable, high-capacity programmable logic solutions that meet commercial operating and regulatory expectations.

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