5SGXMA7N3F45C2WN

The 5SGXMA7N3F45C2WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC supplied in a 1932-BBGA FCBGA package. It delivers high on-chip logic and memory capacity together with a large I/O complement for demanding programmable logic designs.

Designed as a commercial-grade device, this Stratix V GX part is specified for operation from 0 °C to 85 °C and a core supply voltage range of 870 mV to 930 mV. The device datasheet documents its electrical and switching characteristics, I/O timing, and other core/periphery parameters relevant to system integration.

Key Features

• High Logic Capacity — 622,000 logic elements and 234,720 CLBs provide the programmable fabric needed for complex logic and large designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• Extensive I/O — 840 I/O pins to support dense external connectivity and multi-channel interfaces.
• Package and Mounting — Supplied in a 1932-BBGA (FCBGA) package, 1932-FBGA, FC (45×45) supplier device package; surface-mount mounting type for PCB integration.
• Power and Operating Conditions — Core supply voltage range of 870 mV to 930 mV and commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Documented Electrical Characteristics — Stratix V device datasheet covers electrical, switching, and I/O timing characteristics useful for system-level design and power planning.

Typical Applications

• High-density logic systems — Use where substantial programmable logic resources (622,000 logic elements / 234,720 CLBs) are required to implement complex state machines, datapaths, or custom accelerators.
• Memory-intensive designs — Approximately 51.2 Mbits of embedded memory supports buffering, FIFOs, and large on-chip data structures without external RAM for some use cases.
• I/O-rich interfaces — 840 I/Os enable designs that need many parallel interfaces, multi-lane connectivity, or dense sensor/actuator routing.
• Commercial embedded systems — Specified for 0 °C to 85 °C operation and surface-mount assembly in a high-density BGA footprint for commercial-grade products.

Unique Advantages

• Large programmable fabric: 622,000 logic elements support integration of complex logic, combining multiple functions into a single device to reduce system BOM.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces dependence on external memory for many buffering and caching needs.
• High I/O count: 840 I/Os allow flexible partitioning of interfaces and support for multi-channel external connectivity without multiplexing compromises.
• Compact, manufacturable package: 1932-BBGA FCBGA in a 45×45 supplier package provides a high pin density in a surface-mount form factor compatible with standard PCB assembly.
• Commercial temperature rating & RoHS compliance: Clear operating temperature range (0 °C to 85 °C) and RoHS compliance simplify qualification for commercial-product roadmaps.
• Well-documented device characteristics: The Stratix V device datasheet includes electrical, switching, and I/O timing specifications to support design validation and system integration.

Why Choose 5SGXMA7N3F45C2WN?

The 5SGXMA7N3F45C2WN combines substantial logic resources, a large pool of embedded RAM, and a high I/O count in a single commercial-grade Stratix V GX FPGA package. Its documented electrical and switching characteristics support methodical power, timing, and board-level design.

This device is suited to designers targeting high-density programmable logic integration in commercial applications where large on-chip memory, abundant I/O, and a compact BGA package are required. The combination of capacity and documented specifications helps reduce system complexity and supports scalable, maintainable designs.

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