5SGXMA7N3F45C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 389 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N3F45C2N – Stratix® V GX FPGA, 840 I/Os, approximately 51.2 Mbits RAM, 622,000 logic elements, 1932-BBGA
The 5SGXMA7N3F45C2N is a Stratix® V GX field programmable gate array (FPGA) in a high-pin-count BGA package, offered in a commercial temperature grade. It provides a dense logic fabric with 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/O pins in a surface-mount 1932-BBGA FCBGA package.
This device is aimed at designs requiring large on-chip resources and extensive I/O connectivity within the Stratix V GX family. Core attributes such as the large logic-element count, substantial embedded RAM, and a wide I/O complement enable integration of complex digital functions in a single device while operating within the specified commercial voltage and temperature ranges.
Key Features
- Logic Capacity 622,000 logic elements (cells) for implementing complex logic, state machines, and custom processing pipelines.
- On-chip Memory Approximately 51.2 Mbits of embedded RAM to support large buffers, FIFOs, and memory-intensive functions.
- I/O and Package 840 user I/Os delivered through a high-density 1932-BBGA (FCBGA) surface-mount package; supplier package reference 1932-FBGA, FC (45×45).
- Power and Core Supply Core operating voltage specified from 870 mV to 930 mV for device supply planning and power budgeting.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C; surface-mount mounting type for PCB assembly.
- Family-level Transceiver Information Stratix V GX family transceiver speed grades are documented in the device series datasheet (examples include GX channel grades up to 14.1 Gbps and other GX/GT grade options), enabling evaluation of high-speed serial channel capabilities at the family level.
- Regulatory Compliance RoHS-compliant status for environmental and manufacturing compliance.
Typical Applications
- High-density digital integration Consolidate multiple logic functions into a single device using the 622,000 logic elements and large embedded RAM.
- Large I/O systems Designs requiring a broad set of parallel or multiplexed interfaces benefit from the 840 available I/Os and high-pin-count BGA package.
- Memory-rich buffering Implement deep buffering, packet queues, or frame storage using approximately 51.2 Mbits of on-chip RAM.
Unique Advantages
- Substantial on-chip resources: The combination of 622,000 logic elements and approximately 51.2 Mbits of embedded memory reduces the need for external logic and memory, simplifying board design.
- High I/O density: 840 I/Os in a 1932-BBGA package enable dense connectivity for multi-channel interfaces and complex board-level routing.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching requirements for commercial or lab-grade environments.
- Predictable core supply range: Defined core voltage range (870 mV–930 mV) supports precise power-supply design and power budgeting.
- Surface-mount assembly: The FCBGA package form-factor supports standard surface-mount PCB assembly processes for volume manufacturing.
- RoHS compliance: Meets RoHS requirements to align with environmental and manufacturing directives.
Why Choose 5SGXMA7N3F45C2N?
This Stratix V GX FPGA device brings a large logic capacity, significant embedded memory, and a high I/O count in a single surface-mount 1932-BBGA package, making it suitable for complex digital designs that require substantial on-chip resources and extensive board-level connectivity. Its commercial temperature rating and clearly defined core supply range enable straightforward integration into commercial-system power and thermal envelopes.
For designs that need the resource scale of the Stratix V GX family—many logic elements, abundant on-chip RAM, and high I/O density—the 5SGXMA7N3F45C2N provides a compact, RoHS-compliant option in a standard FCBGA footprint.
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