5SGXMA7N3F45C2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 389 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N3F45C2N – Stratix® V GX FPGA, 840 I/Os, approximately 51.2 Mbits RAM, 622,000 logic elements, 1932-BBGA

The 5SGXMA7N3F45C2N is a Stratix® V GX field programmable gate array (FPGA) in a high-pin-count BGA package, offered in a commercial temperature grade. It provides a dense logic fabric with 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/O pins in a surface-mount 1932-BBGA FCBGA package.

This device is aimed at designs requiring large on-chip resources and extensive I/O connectivity within the Stratix V GX family. Core attributes such as the large logic-element count, substantial embedded RAM, and a wide I/O complement enable integration of complex digital functions in a single device while operating within the specified commercial voltage and temperature ranges.

Key Features

  • Logic Capacity  622,000 logic elements (cells) for implementing complex logic, state machines, and custom processing pipelines.
  • On-chip Memory  Approximately 51.2 Mbits of embedded RAM to support large buffers, FIFOs, and memory-intensive functions.
  • I/O and Package  840 user I/Os delivered through a high-density 1932-BBGA (FCBGA) surface-mount package; supplier package reference 1932-FBGA, FC (45×45).
  • Power and Core Supply  Core operating voltage specified from 870 mV to 930 mV for device supply planning and power budgeting.
  • Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C; surface-mount mounting type for PCB assembly.
  • Family-level Transceiver Information  Stratix V GX family transceiver speed grades are documented in the device series datasheet (examples include GX channel grades up to 14.1 Gbps and other GX/GT grade options), enabling evaluation of high-speed serial channel capabilities at the family level.
  • Regulatory Compliance  RoHS-compliant status for environmental and manufacturing compliance.

Typical Applications

  • High-density digital integration  Consolidate multiple logic functions into a single device using the 622,000 logic elements and large embedded RAM.
  • Large I/O systems  Designs requiring a broad set of parallel or multiplexed interfaces benefit from the 840 available I/Os and high-pin-count BGA package.
  • Memory-rich buffering  Implement deep buffering, packet queues, or frame storage using approximately 51.2 Mbits of on-chip RAM.

Unique Advantages

  • Substantial on-chip resources: The combination of 622,000 logic elements and approximately 51.2 Mbits of embedded memory reduces the need for external logic and memory, simplifying board design.
  • High I/O density: 840 I/Os in a 1932-BBGA package enable dense connectivity for multi-channel interfaces and complex board-level routing.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching requirements for commercial or lab-grade environments.
  • Predictable core supply range: Defined core voltage range (870 mV–930 mV) supports precise power-supply design and power budgeting.
  • Surface-mount assembly: The FCBGA package form-factor supports standard surface-mount PCB assembly processes for volume manufacturing.
  • RoHS compliance: Meets RoHS requirements to align with environmental and manufacturing directives.

Why Choose 5SGXMA7N3F45C2N?

This Stratix V GX FPGA device brings a large logic capacity, significant embedded memory, and a high I/O count in a single surface-mount 1932-BBGA package, making it suitable for complex digital designs that require substantial on-chip resources and extensive board-level connectivity. Its commercial temperature rating and clearly defined core supply range enable straightforward integration into commercial-system power and thermal envelopes.

For designs that need the resource scale of the Stratix V GX family—many logic elements, abundant on-chip RAM, and high I/O density—the 5SGXMA7N3F45C2N provides a compact, RoHS-compliant option in a standard FCBGA footprint.

Request a quote or submit an RFQ to evaluate 5SGXMA7N3F45C2N for your next design. Provide your quantity and delivery requirements to receive pricing and availability information.

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