5SGXMA7N3F45C2LN

The 5SGXMA7N3F45C2LN is a Stratix® V GX field programmable gate array (FPGA) in a 1932-BBGA FCBGA package. It delivers substantial logic capacity, abundant embedded memory, and a high I/O count for complex, high-density digital designs.

Designed for commercial-temperature applications, this device combines 622,000 logic elements with approximately 51.2 Mbits of on-chip RAM and 840 I/Os, making it suitable for systems that require large programmable logic fabrics and extensive I/O connectivity while operating within a 0 °C to 85 °C range.

Key Features

• Logic Capacity — 622,000 logic elements to implement large-scale digital functions and complex logic architectures.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, datapaths, and storage close to logic.
• I/O Density — 840 I/Os to support wide parallel interfaces and multiple external peripherals.
• Power Supply — Core voltage supply specified from 820 mV to 880 mV for core power planning and system design.
• Package & Mounting — 1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45 × 45); surface-mount mounting type for board-level integration.
• Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial applications.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Implement large custom datapaths, signal processing pipelines, and complex control logic using the device’s 622,000 logic elements and on-chip RAM.
• High-throughput I/O systems — Use the 840 I/Os for parallel interfaces, multi-channel data acquisition, or broad peripheral connectivity.
• FPGA-based integration — Consolidate multiple functions into a single programmable device with substantial logic and memory resources to reduce external components.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable implementation of complex, multi-module designs on a single device, reducing board-level partitioning.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM provides local storage for buffers and state machines, lowering external memory requirements.
• Extensive I/O resources: 840 I/Os support broad connectivity, simplifying routing for multi-interface systems.
• Compact FCBGA package: 1932-BBGA (45 × 45) surface-mount package balances high pin count with board-space considerations for dense PCBs.
• Commercial temperature operation: Specified 0 °C to 85 °C operating range aligns with standard commercial deployments.
• RoHS compliant: Conforms to lead-free manufacturing requirements for environmental compliance.

Why Choose 5SGXMA7N3F45C2LN?

The 5SGXMA7N3F45C2LN positions itself where large programmable logic capacity, substantial embedded memory, and high I/O density are required within a commercial-temperature FPGA. Its combination of 622,000 logic elements, roughly 51.2 Mbits of on-chip RAM, and 840 I/Os supports consolidation of complex functions and wide peripheral interfacing in a single device.

This device is well suited to designers and engineers building dense digital systems that need significant on-chip resources, compact packaging, and RoHS compliance. Its defined voltage and temperature ranges simplify system power and thermal planning while providing a clearly specified commercial-grade option for high-capacity FPGA designs.

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