5SGXMA7N3F45C2G

The 5SGXMA7N3F45C2G is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a high-density BGA package. It delivers a large logic fabric and substantial on-chip memory together with a high pin count, making it suitable for complex digital designs that require dense logic, extensive I/O, and integrated RAM.

As a commercial-grade Stratix V device, its electrical and switching characteristics are described in the Stratix V device datasheet, providing design-level detail for integration into demanding embedded and communication systems.

Key Features

• Core logic — 622,000 logic elements for implementing large-scale digital designs and complex custom logic.
• Embedded memory — approximately 51.2 Mbits of on-chip RAM to support large buffers, state storage, and memory-intensive logic without extensive external memory.
• I/O density — 840 I/O pins to support high connectivity requirements and multiple peripheral interfaces.
• Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and a defined core supply voltage range of 870 mV to 930 mV.
• Package & mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45x45); surface-mount form factor for high-density board designs.
• Environmental compliance — RoHS compliant.
• Stratix V family characteristics — Device aligns with the Stratix V series electrical and switching specifications documented in the series datasheet, which includes available core and transceiver speed-grade options at the family level.

Typical Applications

• High-density signal processing — Implement complex DSP pipelines and large combinational/sequential logic using the device’s extensive logic elements and embedded RAM.
• High-bandwidth I/O systems — Support dense peripheral arrays, multi-channel interfaces, and board-level connectivity with 840 I/O pins.
• Custom accelerators and protocol offload — Create hardware-accelerated engines and protocol controllers that reduce external components by using abundant on-chip resources.

Unique Advantages

• Highly integrated logic and memory: Large logic capacity combined with approximately 51.2 Mbits of embedded RAM reduces system-level BOM and external memory requirements.
• Extensive I/O capability: 840 I/O pins deliver flexibility for multi-channel and high-pin-count designs.
• Compact high-pin-count packaging: 1932-BBGA / 1932-FBGA packaging enables a dense surface-mount implementation suitable for space-constrained PCBs.
• Commercial temperature rating: Rated for 0 °C to 85 °C to meet standard commercial environment requirements.
• Defined core supply window: Operates on a controlled 870 mV to 930 mV supply, aiding predictable power integration.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose 5SGXMA7N3F45C2G?

5SGXMA7N3F45C2G positions itself as a high-capacity Stratix V GX FPGA option for designers who need substantial logic density, significant on-chip memory, and broad I/O connectivity in a single surface-mount package. Its commercial-grade rating and clearly defined electrical parameters make it suitable for a wide range of embedded, networking, and processing applications where integration and board-level density are priorities.

Backed by the Stratix V family documentation from Intel, this device offers a scalable platform for custom accelerators, complex protocol implementations, and high-density system designs where long-term product availability and comprehensive device characterization are important.

Request a quote or submit a pricing and availability inquiry for part number 5SGXMA7N3F45C2G to evaluate integration into your next design.