5SGXMA7N3F45C2NCV

The 5SGXMA7N3F45C2NCV is a Stratix V GX field-programmable gate array (FPGA) from Intel designed for high-density, high-performance programmable logic implementations. As a commercial-grade Stratix V GX device, it combines a large logic fabric, substantial on-chip RAM, and a high I/O count to address complex digital integration and high-speed serial interface requirements.

This device is well suited for board-level designs that require extensive programmable logic, significant embedded memory, and many I/O connections while operating within commercial temperature and voltage ranges.

Key Features

• Logic Capacity  Provides 622,000 logic elements to implement large, complex digital designs and custom processing pipelines.
• Embedded Memory  Includes approximately 51.2 Mbits of embedded memory for buffering, FIFOs, on-chip data storage, and state machines.
• I/O Density  Offers 840 general-purpose I/O pins for broad board-level connectivity and dense peripheral interfacing.
• High‑Speed Transceiver (series-level)  Stratix V GX devices include high-speed GX transceiver channel support; per the Stratix V device datasheet, GX channel data rates in the family reach up to 14.1 Gbps across defined speed grades.
• Power and Core Voltage  Operates from a core voltage supply range of 870 mV to 930 mV to match industry-standard FPGA power rails.
• Package and Mounting  Supplied in a 1932‑BBGA FCBGA package (supplier package 1932‑FBGA, FC 45×45) and intended for surface-mount PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0°C to 85°C and specified as a commercial-grade device.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-speed serial interfaces  Leverage the Stratix V GX transceiver capabilities (series-level support up to 14.1 Gbps) for designs that require multi‑Gbps serial links.
• Large-scale programmable logic integration  Use the 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM to consolidate complex functions and reduce external logic.
• I/O‑intensive designs  Employ the 840 I/Os for dense board-level connectivity, multiple parallel interfaces, and complex peripheral routing.

Unique Advantages

• High-density programmable fabric: 622,000 logic elements support substantial logic integration for complex system functions on a single FPGA.
• Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM provides local storage for buffering, packet handling, and state retention without external memory.
• Broad I/O capability: 840 I/Os enable flexible interfacing and high connector density for advanced board designs.
• Series-level high-speed transceivers: Stratix V GX family transceivers support multi-gigabit channel rates (up to 14.1 Gbps per datasheet), facilitating high-throughput serial links.
• Commercial-grade operating range: Specified for 0°C to 85°C operation and compatible with standard commercial system environments.
• Compact high-pin-count package: 1932-BBGA (45×45 mm) FCBGA package provides a dense, surface-mount solution for space-constrained high-performance PCBs.

Why Choose 5SGXMA7N3F45C2NCV?

The 5SGXMA7N3F45C2NCV positions itself as a high-density, commercial-grade Stratix V GX FPGA suited to designs that require a large logic footprint, ample on-chip memory, high I/O counts, and series-level support for multi-gigabit serial channels. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/Os makes it appropriate for complex digital consolidation and high-throughput connectivity within commercial temperature and voltage constraints.

Manufactured by Intel and documented in the Stratix V device datasheet, this device offers a clear specification set for engineering evaluation and system-level integration where dense programmable logic and high-speed serial capability are primary requirements.

Request a quote or submit a product inquiry to obtain pricing, lead time, and availability for the 5SGXMA7N3F45C2NCV.