5SGXMA7N3F45C3G

The 5SGXMA7N3F45C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1932-BBGA FCBGA package for surface-mount assembly. It provides a high logic capacity and substantial embedded memory with a large I/O count, targeting designs that require dense programmable logic, significant on-chip RAM, and extensive connectivity within commercial-temperature environments.

Designed for commercial-grade deployments, this FPGA operates across a 0 °C to 85 °C range and is RoHS compliant. Core supply voltage is specified between 820 mV and 880 mV, enabling use in systems designed around low-voltage FPGA cores.

Key Features

• Core FPGA Architecture Stratix V GX family device offering high-density programmable logic in an FPGA form factor.
• Logic Capacity 622,000 logic elements to support complex digital designs and large-scale integration.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM for data buffering, caches, and scratchpad memory.
• I/O Density 840 user I/O pins to simplify external interfacing and system-level connectivity.
• Power Core voltage supply range: 820 mV to 880 mV (0.82–0.88 V) for the device core.
• Package & Mounting 1932-BBGA, FCBGA package (supplier designation: 1932-FBGA, FC (45×45)); surface-mount device.
• Operating Conditions Commercial temperature grade with operating range 0 °C to 85 °C.
• Compliance RoHS compliant.
• Family-Level Transceiver Options Stratix V GX family devices are documented with multiple transceiver and core speed grade offerings in the device datasheet.

Typical Applications

• High-density digital processing — Use the large logic capacity and on-chip RAM for complex signal processing, algorithm acceleration, or custom compute engines.
• I/O-intensive systems — The 840 available I/Os enable rich peripheral interfacing and multi-channel data aggregation without immediate need for external IO expanders.
• Memory-dependent designs — Approximately 51.2 Mbits of embedded memory supports buffering, packet handling, and intermediate data storage.
• Advanced prototyping and integration — Surface-mount 1932-BBGA packaging and commercial temperature rating make the device suitable for development platforms and production systems in commercial environments.

Unique Advantages

• High integration density: 622,000 logic elements reduce the need for multiple discrete devices and lower overall system BOM complexity.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes reliance on external memory for many buffering and scratchpad use cases.
• Extensive I/O: 840 I/O pins simplify system connectivity and reduce external I/O components.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation for mainstream embedded and communications equipment.
• Surface-mount BGA package: 1932-BBGA (45×45) supports high pin-count routing density in compact board layouts.
• Standards-compliant manufacturing: RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose 5SGXMA7N3F45C3G?

The 5SGXMA7N3F45C3G brings together a high logic element count, substantial on-chip RAM, and a large I/O complement in a commercial-grade Stratix V GX FPGA. Its package and electrical characteristics make it suitable for designers who need to consolidate logic, memory, and connectivity into a single programmable device while meeting standard commercial operating conditions.

As part of the Intel Stratix V GX family and backed by the published device datasheet, this FPGA is appropriate for teams building scalable, high-density systems where integration and clear device specifications are key to design confidence.

Request a quote or submit your specifications to receive pricing and availability for the 5SGXMA7N3F45C3G. Our team will respond with lead-time and ordering information to help move your design forward.