5SGXMA7N3F45C3NCV

The 5SGXMA7N3F45C3NCV is a Stratix® V GX Field Programmable Gate Array (FPGA) IC optimized for large, high-density programmable-logic designs. Built on the Stratix V GX family, this commercial‑grade device provides a high count of logic elements and substantial on‑chip RAM to support complex digital processing and high‑speed serial transceiver applications described in the device series documentation.

Key value comes from the device's integration of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 840 I/O pins in a 1932‑BBGA FCBGA package—enabling dense system integration while meeting commercial temperature and voltage requirements.

Key Features

• Logic Capacity  622,000 logic elements (cells) to support large-scale, complex FPGA designs and high gate-count implementations.
• Embedded Memory  Approximately 51.2 Mbits of total on‑chip RAM for buffering, FIFOs, and memory‑intensive algorithms.
• I/O Density  Up to 840 I/O pins to enable extensive external interfacing and high pin‑count system connectivity.
• Package & Mounting  1932‑BBGA (FCBGA) package, supplier device package 1932‑FBGA FC (45×45); surface‑mount mounting type for compact board integration.
• Power and Core Voltage  Core supply range specified at 0.820 V to 0.880 V, enabling defined power delivery and planning for core rails.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.
• Series Documentation  Stratix V device datasheets include electrical and switching characteristics, including transceiver and I/O timing guidance pertinent to GX family devices.

Typical Applications

• High‑speed communications and networking  Stratix V GX family datasheet details transceiver speed grades, supporting designs that require high‑bandwidth serial links and protocol processing.
• Signal processing and compute acceleration  Large logic capacity and abundant on‑chip RAM make the device suitable for DSP pipelines, packet processing, and hardware acceleration tasks.
• High‑density programmable logic systems  High I/O count and a compact FCBGA package enable dense board implementations where integration and connectivity are critical.

Unique Advantages

• High logic and memory integration: The combination of 622,000 logic elements and ~51.2 Mbits of embedded RAM reduces the need for external memory and simplifies board-level architecture.
• Extensive I/O capability: With up to 840 I/O pins, the device supports complex front‑end interfaces and multiple peripheral connections without immediate I/O expansion.
• Compact, manufacturable package: The 1932‑BBGA FCBGA package and surface‑mount format provide a balance of density and PCB assembly compatibility.
• Defined electrical profile: Core supply specified between 0.820 V and 0.880 V aids in power supply design and thermal planning.
• Commercial temperature rating: Rated 0 °C to 85 °C for applications within standard commercial operating environments.
• RoHS compliant: Meets RoHS environmental requirements for lead‑free manufacturing processes.

Why Choose 5SGXMA7N3F45C3NCV?

The 5SGXMA7N3F45C3NCV positions itself as a high‑capacity Stratix V GX FPGA option for designers who require significant on‑chip logic resources, ample embedded memory, and a large complement of I/Os in a single package. Its commercial temperature rating and defined core voltage make it suitable for production systems operating within standard commercial environments.

This device is well suited to engineering teams developing high‑performance communications, signal processing, and compute‑intensive systems that benefit from tight integration of logic, memory, and I/O in a compact FCBGA footprint, with documentation that covers the necessary electrical and switching characteristics for implementation.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXMA7N3F45C3NCV for your next high‑density FPGA design.