5SGXMA7N3F45C4G

The 5SGXMA7N3F45C4G is a Stratix V GX field programmable gate array (FPGA) from Intel, delivered in a 1932‑BBGA FCBGA package for surface‑mount assembly. It provides very large logic capacity and on‑chip memory alongside a high I/O count, making it suitable for designs that require dense programmable logic and extensive interfacing.

Key electrical and environmental characteristics include a core voltage supply range of 820 mV to 880 mV and a commercial operating temperature grade of 0°C to 85°C. The device is RoHS compliant and is documented in the Stratix V device datasheet.

Key Features

• Core Logic  Approximately 622,000 logic elements to support large, complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM (total RAM bits: 51,200,000) for large buffering and data storage.
• I/O Capability  840 user I/O pins to support extensive peripheral and board‑level connectivity.
• Power and Voltage  Rated supply range from 820 mV to 880 mV to match platform power‑rail requirements.
• Package & Mounting  1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface mount type for standard PCB assembly.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0°C to 85°C.
• Regulatory  RoHS compliant for environmental material requirements.

Typical Applications

• High‑density digital processing  Large logic element count and on‑chip RAM enable complex data‑path and compute implementations.
• High‑I/O interface systems  840 I/O pins make the device suitable for designs requiring many peripheral or board‑level connections.
• Protocol bridging and aggregation  Ample logic and memory resources support protocol conversion, aggregation, and packet processing functions.
• GX transceiver‑based systems  Part of the Stratix V GX family—suitable for designs leveraging GX transceiver capabilities as documented for the family.

Unique Advantages

• High logic capacity: The device’s ~622,000 logic elements let you implement large, complex designs without external logic expansion.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory in many buffering and caching use cases.
• Extensive I/O count: 840 I/Os provide flexibility to connect multiple peripherals, interfaces, and board functions directly to the FPGA.
• Compact, manufacturable package: The 1932‑BBGA FCBGA package and surface‑mount mounting simplify PCB integration and automated assembly.
• Commercial temperature grade: Rated for 0°C to 85°C operation to meet standard commercial application environments.
• RoHS compliance: Meets common environmental material requirements for modern electronics production.

Why Choose 5SGXMA7N3F45C4G?

The 5SGXMA7N3F45C4G positions itself as a high‑capacity Stratix V GX FPGA option for designs that need substantial logic resources, significant embedded memory, and a large number of I/Os in a compact FCBGA form factor. Its commercial temperature rating and documented electrical characteristics make it appropriate for demanding commercial applications that require verified specifications.

As a member of the Stratix V family with published datasheet documentation, this device is suitable for engineers and teams building scalable, logic‑intensive systems while relying on established device specifications for design and validation.

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