5SGXMA7N3F45I3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 699 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N3F45I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 I/O, 1932‑BBGA
The 5SGXMA7N3F45I3G is an industrial‑grade Stratix V GX FPGA in a 1932‑FBGA (45×45 mm) package designed for high‑density programmable logic and system integration. It provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory, paired with up to 840 I/O pins for dense system interfacing.
Built on the Stratix V GX family architecture, this device targets designs that require large programmable logic capacity, substantial on‑chip memory, and extensive I/O connectivity within an industrial temperature range and surface‑mount packaging.
Key Features
- Logic Capacity 622,000 logic elements suitable for complex, large‑scale digital designs.
- Embedded Memory Approximately 51.2 Mbits of on‑chip RAM to support wide data buffering and state storage needs.
- I/O Density Up to 840 I/O pins to support extensive peripheral connectivity and multi‑lane interfaces.
- Transceiver Capability (Series) Stratix V GX series devices support high‑speed transceiver channel options (example series capability includes up to 14.1 Gbps per GX channel), enabling high‑bandwidth serial links when used within supported speed grades.
- Power and Core Voltage Core supply voltage range from 820 mV to 880 mV to match platform power requirements.
- Package and Mounting 1932‑BBGA / 1932‑FBGA (45×45 mm) package; surface‑mount device suitable for automated PCB assembly.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- High‑density logic systems Large programmable logic capacity and embedded memory enable complex digital processing, control logic, and state machines.
- High‑bandwidth serial interfaces Series transceiver capability supports designs that require multi‑Gbps serial links for data transport and protocol bridging.
- Dense I/O interfacing Up to 840 I/O pins allow integration with numerous peripherals, sensors, and board‑level interfaces in compact systems.
- Industrial control and instrumentation Industrial temperature range and robust packaging make the device suitable for industrial automation and measurement systems.
Unique Advantages
- High integration density: 622,000 logic elements combined with ~51.2 Mbits of embedded memory reduce the need for external logic and memory components.
- Extensive I/O support: 840 I/O pins enable complex system topologies and flexible peripheral connectivity without additional multiplexing hardware.
- Industrial operating range: Specified for −40 °C to 100 °C operation to support deployment in demanding environments.
- Robust packaging for surface mount assembly: 1932‑FBGA (45×45 mm) package offers a high‑pin‑count solution compatible with automated PCB manufacturing.
- Low‑voltage core operation: Core voltage range of 820 mV to 880 mV supports modern low‑power FPGA core domains and power architectures.
- Regulatory compliance: RoHS compliance simplifies regulatory and environmental considerations for product development.
Why Choose 5SGXMA7N3F45I3G?
The 5SGXMA7N3F45I3G positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA for designs that demand large logic resources, significant embedded memory, and abundant I/O. Its package and mounting options support production‑level PCB assembly, while the specified operating temperature and RoHS compliance address deployment and regulatory needs.
This device is suitable for engineers and system designers building large, interface‑rich systems where on‑chip integration of logic and memory reduces board complexity and component count. The Stratix V GX family characteristics add high‑speed serial transceiver options for teams integrating high‑bandwidth links into their architectures.
Request a quote or submit an inquiry for pricing and availability to begin integrating the 5SGXMA7N3F45I3G into your next design.

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