5SGXMA7N3F45I3G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA

Quantity 699 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N3F45I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 I/O, 1932‑BBGA

The 5SGXMA7N3F45I3G is an industrial‑grade Stratix V GX FPGA in a 1932‑FBGA (45×45 mm) package designed for high‑density programmable logic and system integration. It provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory, paired with up to 840 I/O pins for dense system interfacing.

Built on the Stratix V GX family architecture, this device targets designs that require large programmable logic capacity, substantial on‑chip memory, and extensive I/O connectivity within an industrial temperature range and surface‑mount packaging.

Key Features

  • Logic Capacity  622,000 logic elements suitable for complex, large‑scale digital designs.
  • Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support wide data buffering and state storage needs.
  • I/O Density  Up to 840 I/O pins to support extensive peripheral connectivity and multi‑lane interfaces.
  • Transceiver Capability (Series)  Stratix V GX series devices support high‑speed transceiver channel options (example series capability includes up to 14.1 Gbps per GX channel), enabling high‑bandwidth serial links when used within supported speed grades.
  • Power and Core Voltage  Core supply voltage range from 820 mV to 880 mV to match platform power requirements.
  • Package and Mounting  1932‑BBGA / 1932‑FBGA (45×45 mm) package; surface‑mount device suitable for automated PCB assembly.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • High‑density logic systems  Large programmable logic capacity and embedded memory enable complex digital processing, control logic, and state machines.
  • High‑bandwidth serial interfaces  Series transceiver capability supports designs that require multi‑Gbps serial links for data transport and protocol bridging.
  • Dense I/O interfacing  Up to 840 I/O pins allow integration with numerous peripherals, sensors, and board‑level interfaces in compact systems.
  • Industrial control and instrumentation  Industrial temperature range and robust packaging make the device suitable for industrial automation and measurement systems.

Unique Advantages

  • High integration density: 622,000 logic elements combined with ~51.2 Mbits of embedded memory reduce the need for external logic and memory components.
  • Extensive I/O support: 840 I/O pins enable complex system topologies and flexible peripheral connectivity without additional multiplexing hardware.
  • Industrial operating range: Specified for −40 °C to 100 °C operation to support deployment in demanding environments.
  • Robust packaging for surface mount assembly: 1932‑FBGA (45×45 mm) package offers a high‑pin‑count solution compatible with automated PCB manufacturing.
  • Low‑voltage core operation: Core voltage range of 820 mV to 880 mV supports modern low‑power FPGA core domains and power architectures.
  • Regulatory compliance: RoHS compliance simplifies regulatory and environmental considerations for product development.

Why Choose 5SGXMA7N3F45I3G?

The 5SGXMA7N3F45I3G positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA for designs that demand large logic resources, significant embedded memory, and abundant I/O. Its package and mounting options support production‑level PCB assembly, while the specified operating temperature and RoHS compliance address deployment and regulatory needs.

This device is suitable for engineers and system designers building large, interface‑rich systems where on‑chip integration of logic and memory reduces board complexity and component count. The Stratix V GX family characteristics add high‑speed serial transceiver options for teams integrating high‑bandwidth links into their architectures.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 5SGXMA7N3F45I3G into your next design.

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