5SGXMA7N3F45C4WN

The 5SGXMA7N3F45C4WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, board‑level programmable logic integration. As a member of the Stratix V GX family, the device combines large logic capacity, substantial embedded memory, and extensive I/O in a high‑pin-count FCBGA package to support complex digital designs.

Targeted at commercial applications, the device offers a balance of performance and integration for systems that require high logic count, significant on‑chip RAM, and large I/O budgets within a surface‑mount 1932‑BBGA package.

Key Features

• High logic density — 622,000 logic elements suitable for large, complex designs and multi‑function FPGA implementations.
• Embedded memory — Approximately 51.2 Mbits of total on‑chip RAM to support buffering, LUT‑based storage, and memory‑intensive algorithms.
• Extensive I/O — 840 user I/O pins to accommodate wide parallel interfaces and high‑pin‑count peripherals.
• High‑pin‑count package — 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45), optimized for dense board routing and thermal characteristics.
• Core voltage — Specified operating supply range from 820 mV to 880 mV for core power planning.
• Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature for standard commercial environments.
• Mounting and compliance — Surface mount device and RoHS compliant.
• Stratix V GX family capabilities — As a member of the Stratix V GX series, the device aligns with the family’s documented electrical and transceiver characteristics for advanced I/O and switching behavior.

Typical Applications

• High‑performance networking and telecommunications — Large logic capacity and extensive I/O make the device suitable for packet processing, interface bridging, and board‑level networking functions that require parallel connectivity.
• Signal processing and compute acceleration — Substantial embedded memory and high logic density support buffering, pipelined DSP, and algorithm acceleration on the FPGA fabric.
• Instrumentation and test equipment — The combination of many I/Os and on‑chip RAM enables complex data acquisition, real‑time processing, and protocol handling in commercial test systems.
• Advanced prototyping and system integration — High logic element count and dense packaging suit integration and prototyping of large SoC components and custom hardware emulation.

Unique Advantages

• Significant programmable capacity: 622,000 logic elements provide room for complex state machines, DSP pipelines, and control logic in a single device.
• Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratchpad needs.
• High I/O count: 840 I/O pins enable wide parallel interfaces and multi‑lane connectivity without external multiplexing.
• High‑pin‑count FCBGA packaging: The 1932‑BBGA (1932‑FBGA, 45×45) package supports dense routing and high integration on modern PCBs.
• Commercial operating range: Rated 0 °C to 85 °C for use in standard commercial products and systems.
• RoHS compliant: Designed to meet common lead‑free manufacturing requirements.

Why Choose 5SGXMA7N3F45C4WN?

The 5SGXMA7N3F45C4WN positions itself as a high‑capacity, commercially graded Stratix V GX FPGA that addresses applications demanding large logic resources, substantial embedded memory, and broad I/O connectivity in a single surface‑mount package. Its specification set supports complex digital designs where board‑level integration and on‑chip memory reduce BOM complexity and external component dependencies.

As part of the Stratix V family, the device fits into a documented device ecosystem suitable for designers who need scalable densities and package options across a series of high‑performance FPGAs.

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