5SGXMA7N3F45I3N

The 5SGXMA7N3F45I3N is an industrial‑grade Stratix V GX FPGA supplied in a high‑density 1932‑ball FCBGA package. It combines a large programmable fabric with extensive I/O and on‑chip memory to support complex, high‑channel designs requiring significant logic capacity and embedded RAM.

This device is specified with an industrial operating temperature range and a low‑voltage core supply, offering designers a high‑integration option where thermal and power constraints are relevant.

Key Features

• Logic Capacity  622,000 logic elements (cells) to implement large, complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of total on‑chip RAM for FIFOs, buffers, and distributed storage.
• High I/O Count  840 user I/Os to support dense board connectivity and multiple parallel interfaces.
• Package  1932‑BBGA / FCBGA package (supplier package: 1932‑FBGA, FC (45×45)) for high‑pin‑count board integration.
• Core Supply  Low‑voltage core operation specified at 0.820 V to 0.880 V to match system power rails and power‑management strategies.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Mounting  Surface mount device designed for automated PCB assembly; RoHS compliant.

Unique Advantages

• High‑density programmable fabric: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board count and system complexity.
• Substantial embedded RAM: Approximately 51.2 Mbits of on‑chip memory supports large buffering and memory‑intensive algorithms without external memory in some designs.
• Extensive I/O capability: 840 I/Os allow flexible interfacing to sensors, transceivers, and parallel bus structures with minimal external multiplexing.
• Industrial reliability: Rated for −40 °C to 100 °C operation, suitable for deployment in industrial environments where extended temperature range is required.
• Compact, high‑pin package: The 1932‑ball FCBGA (45×45) package delivers maximum I/O density and a compact footprint for complex PCBs.
• RoHS compliant: Conforms to RoHS requirements for lead‑free assembly and regulatory compliance.

Why Choose 5SGXMA7N3F45I3N?

The 5SGXMA7N3F45I3N positions itself as a high‑capacity Stratix V GX FPGA designed for systems that require significant programmable logic, large on‑chip RAM, and a high number of I/Os within an industrial temperature envelope. Its low‑voltage core and FCBGA packaging make it suitable for compact, high‑density board designs.

Choose this device when you need a scalable, integrated FPGA solution that combines dense logic, substantial embedded memory, and extensive connectivity while maintaining industrial temperature performance and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMA7N3F45I3N.